Browsing by Author "Kaneko, S."
Now showing 1 - 4 of 4
- Results Per Page
- Sort Options
Publication Characterization of PVD TaN and ALD WNxCy copper diffusion barriers on a porous CVD low-k material
Proceedings paper2004, Advanced Metallization Conference 2003, 21/10/2003, p.723-728Publication Improved low-k dielectric properties using He/H2 plasma for resist removal
Meeting abstract2008, Advanced Metallization Conference - AMC, 23/09/2008Publication Key factors to sustain the extension of a MHM-based integration scheme to medium and high porosity PECVD low-k materials
Proceedings paper2008, 11th IEEE International Interconnect Technology Conference - IITC, 1/06/2008, p.52-54Publication Variation in process conditions of porogen-based low-k films: a method to improve performance without changing existing process steps in a sub-100nm Cu damascene integration route
Meeting abstract2009, 18th Workshop Materials for Advanced Metallization - MAM, 8/03/2009