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Browsing by Author "Karner, Markus"

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    3D TCAD model for poly-Si channel current and variability in vertical NAND flash memory

    Verreck, Devin  
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    Arreghini, Antonio  
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    Schanovsky, Franz
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    Stanojevic, Zlatan
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    Steiner, K.
    Proceedings paper
    2019, International Conference on Simulation of Semiconductor Processes and Devices - SISPAD, 4/09/2019
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    A model for switching traps in amorphous oxides

    Goes, Wolfgang
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    Grasser, Tibor
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    Karner, Markus
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    Kaczer, Ben  
    Proceedings paper
    2009, International Conference on Simulation of Semiconductor processes and Devices - SISPAD, 9/09/2009, p.159-162
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    A Physical TCAD Mobility Model of Amorphous In-Ga-Zn-O (a-IGZO) Devices with Spatially Varying Mobility Edges, Band-Tails, and Enhanced Low-Temperature Convergence

    Thesberg, Mischa
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    Schanovsky, Franz
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    Zhao, Ying  
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    Karner, Markus
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    Gonzalez-Medina, Jose Maria
    Journal article
    2024, MICROMACHINES, (15) 7, p.Art. 829
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    Modeling the Operation of Charge Trap Flash Memory-Part II: Understanding the ISPP Curve With a Semianalytical Model

    Verreck, Devin  
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    Schanovsky, Franz
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    Arreghini, Antonio  
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    Van den Bosch, Geert  
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    Stanojevic, Zlatan
    Journal article
    2024, IEEE TRANSACTIONS ON ELECTRON DEVICES, (71) 1, p.554-559
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    On the Modeling of Polycrystalline Ferroelectric Thin Films: Landau-Based Models Versus Monte Carlo-Based Models Versus Experiment

    Thesberg, Mischa
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    Roussel
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    Stanojevic, Zlatan
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    Baumgartner, Oskar
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    Schanovsky, Franz
    Journal article
    2022-06, IEEE TRANSACTIONS ON ELECTRON DEVICES, (69) 6, p.3105-3112
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    Quantitative 3-D model to explain large single trap charge variability in vertical NAND memory

    Verreck, Devin  
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    Arreghini, Antonio  
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    Bastos, Joao  
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    Schanovsky, Franz
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    Mitterbauer, Ferdinand
    Proceedings paper
    2019, IEEE International Electron Devices Meeting - IEDM, 7/12/2019, p.755-758
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    Statistical Poly-Si grain boundary model with discrete charging defects and its 2D and 3D implementation for vertical 3D NAND channels

    Degraeve, Robin  
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    Clima, Sergiu  
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    Putcha, Vamsi  
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    Kaczer, Ben  
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    Roussel, Philippe  
    ;
    Linten, Dimitri  
    Proceedings paper
    2015, International Electron Devices Meeting - IEDM, 7/12/2015, p.121-124

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