Browsing by Author "Kiesewetter, Joerg"
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Publication A full-automatic test system for characterizing wide-I/O micro-bump probe cards
; ; ; ;Kiesewetter, Joerg ;Hill, EricSmith, KenProceedings paper2017-06, IEEE Semiconductor Wafer Test Workshop - SWTW, 4/06/2017, p.812-848Publication A fully automatic test system for characterizing large-array fine-pitch micro-bump probe cards
; ; ; ;Kiesewetter, Joerg ;Hill, EricSmith, KenProceedings paper2017-09, IEEE International Test Conference Asia - ITC-Asia, 13/09/2017Publication Automated testing of bare die-to-die stacks
Proceedings paper2015-05, IEEE European Test Symposium - ETS, 25/05/2015Publication Automated testing of bare die-to-die stacks
Proceedings paper2015-07, TestVision 2020 Workshop, 15/07/2015, p.1-25Publication Automated testing of bare die-to-die stacks
Proceedings paper2015-10, IEEE International Test Conference - ITC, 6/10/2015, p.1-10Publication Automated testing of singulated die-to-die stacks
Proceedings paper2015-09, COMPASS - Cascade Microtech User Meeting, 8/09/2015Publication Direct probing on large-array fine-pitch micro-bumps of a wide-I/O logic-memory interface
Proceedings paper2014-10, IEEE International Test Conference - ITC, 21/10/2014, p.1-10Publication Direct probing on large-array fine-pitch micro-bumps of a wide-I/O logic-memory interface
Proceedings paper2014-10, Cascade Microtech COMPASS User Conference, 9/10/2014Publication Evaluation of advanced probe cards for large-array fine-pitch micro-bumps
; ; ; ;Kiesewetter, Joerg ;Smith, KenHill, EricJournal article2017-11, Chip Scale Review, (21) 6, p.16-20Publication Probing of large-array, fine-pitch microbumps for 3D ICs
Proceedings paper2017-05, NI Week Engineering Impact Award, 22/05/2017, p.1-4Publication Very small pitch micro bump array probing
Oral presentation2013, IEEE Semiconductor Wafer Test WorkshopPublication Wafer probing on fine-pitch micro-bumps for 2.5D- and 3D-SICs
Oral presentation2011, IEEE Semiconductor Wafer Test Workshop - SWTWPublication Wafer probing on fine-pitch micro-bumps for 2.5D- and 3D-SICs
;Thaerigen, Thomas ;Kanev, Stojan ;Kiesewetter, Joerg ;Hanaway, PeterStrid, EricProceedings paper2011-10, Semicon 13th European Manufacturing Test Conference - EMTC, 12/10/2011