Browsing by Author "Kirimura, Tomoyuki"

Copper electromigration failure times evaluated over a wide range of voiding phases

Electromigration-driven void nucleation and growth in 30nm wide Cu line: Metal cap impact on interfacial Cu diffusion

In-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structures

In-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structures

Initial void characterization in 30nm wide polycrystalline Cu line using a local sense EM test structure

Integration of a k=2.3 spin-on polymer for the sub-28nm technology node