Browsing by Author "Kostermans, Maarten"
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Publication Dependence of etching rate on aspect ratio for high aspect TSV etching
Publication Exploring high aspEct ratio 2μm TSV (25:1)
Proceedings paper2011-11, 64th Annual Gaseous Electronics Conference - GEC, 14/11/2011Publication Impact of thinning and through silicon via proximity on high-k / metal gate first CMOS performance
Proceedings paper2010, IEEE Symposium on VLSI Technology, 15/06/2010, p.109-110Publication Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers
Proceedings paper2011-06, IEEE 61st Electronic Components and Technology Conference - ECTC, 31/05/2011, p.1384-1388Publication Novel dual layer floating gate structure as enabler of fully planar flash memory
Proceedings paper2010, IEEE Symposium on VLSI Technology, 15/06/2010, p.129-130Publication Through-silicon via technology for three-dimensional integrated circuit manufacturing
Proceedings paper2012, 35th International Electronics Manufacturing Technology Conference - IEMT, 6/11/2012