Browsing by Author "La Tulipe, Douglas Charles"
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Publication A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
Proceedings paper2021, IEEE 71st Electronic Components and Technology Conference (ECTC), JUN 01-JUL 04, 2021, p.1119-1124Publication Confined IMCs for low temperature and high throughput D2W bonding
Proceedings paper2022, International Conference on Electronics Packaging (ICEP), MAY 11-14, 2022, p.131-132Publication Demonstration of a collective hybrid die-to-wafer integration using glass carrier
Proceedings paper2021, IEEE 71st Electronic Components and Technology Conference (ECTC), JUN 01-JUL 04, 2021, p.2064-2070Publication Fundamental study of IMC grains at low anneal temperature
Proceedings paper2022, International Conference on Electronics Packaging (ICEP), MAY 11-14, 2022, p.133-134Publication Low temperature backside damascene processing on temporary carrier wafer targeting 7 mu m and 5 mu m pitch microbumps for N equal and greater than 2 die to wafer TCB stacking
Proceedings paper2022, 72nd IEEE Electronic Components and Technology Conference (ECTC), MAY 31-JUN 01, 2022, p.1108-1113Publication Overlay challenges in 3D heterogeneous integration
Proceedings paper2022, Conference on Metrology, Inspection, and Process Control XXXVI Part of SPIE Advanced Lithography and Patterning Conference, FEB 24-MAY 27, 2022, p.Art. 120530DPublication Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding With sub-300 nm Alignment Precision
Journal article2023, IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, (29) 6, p.Art. 8200311