Browsing by Author "Labie, Riet"
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Publication 18% efficiency IBC cell with rear-surface processed on quartz
Journal article2013, IEEE Journal of Photovoltaics, (3) 2, p.684-689Publication A PoF based methodology to assess the reliability of a sensor module operating in harsh industrial environments
Proceedings paper2022-04-20, 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), APR 25-27, 2022Publication A simple copper metallisation process for high cell efficiencies and reliable modules
Proceedings paper2012, 27th European Photovoltaic Solar Energy Conference and Exhibition - EUPVSEC, 24/10/2012, p.538-543Publication BGA electromigration behavior and why it has become the bottleneck
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.678-684Publication Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration
Proceedings paper2018, 19th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics & Microsysystems - EuroSimE, 16/04/2018, p.1-6Publication Bond pad pitch reduction down to 40 μm: influence on solder joint fatigue for flip chip structures
Proceedings paper2002, Proceedings of the 3rd Eurosime Conference, 14/04/2002, p.316-321Publication Cell-module integration concept compatible with c-Si epitaxial thin foils and with efficiencies over 18%
Proceedings paper2012, 27th European Photovoltaic Solar Energy Conference and Exhibition - EUPVSEC, 24/09/2012, p.2207-2211Publication Comparison of a Cu UBM versus a Co UBM for Sn flip chip bumps
Proceedings paper2005-06, Proceeding of the 2005 Electronic Components and Technology conference ECTC '05. Proceedings, 31/05/2005, p.449-451Publication Cost-effective and reliable Ni/Cu plating for p- and n-type PERx silicon solar cells
Journal article2013, Photovoltaics International. The Technology Resource for PV Professionals, 21, p.62Publication Creep behavior of mixed SAC 405/ SnPb soldered assemblies in shear loading
Proceedings paper2007, 9th Electronics Packaging Technology Conference - EPTC, 10/12/2007, p.703-712Publication Crystalline thin-foil silicon solar cells: where crystalline quality meets thin-film processing
Journal article2012, Progress in Photovoltaics Research and Applications, (20) 6, p.770-784Publication Cu plated I-perl cells: ageing and humidity reliability tests
Proceedings paper2011, 26th European Photovoltaic Solar Energy Conference and Exhibition - EU PVSEC, 5/09/2011, p.1195-1198Publication Cu pumping in TSVs: Effect of pre-CMP thermal budget
Journal article2011, Microelectronics Reliability, (51) 9_11, p.1856-1859Publication Cu-Cu bonding alternative to solder based micro-bumping
Proceedings paper2007, 9th Electronics Packaging Technology Conference - EPTC, 10/12/2007, p.315-318Publication Cu/Sn microbumps interconnect for 3D TSV chip stacking
Proceedings paper2010, IEEE 60th Electronic Components and Technology Conference - ECTC, 1/06/2010, p.858-863Publication Design issues and cosiderations for low-cost 3D TSV IC technology
Proceedings paper2010, IEEE International Solid-State Circuits Conference - ISSCC, 8/02/2010, p.148-149Publication Detailed structural and electrical characterization of plated crystalline silicon solar cells
Journal article2018-05, Solar Energy Materials and Solar Cells, 184, p.57-66Publication Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures
Journal article2012, Microelectronics Reliability, (52) 9_10, p.1971-197