Browsing by Author "Lam, Kan Wai"
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Publication Advanced wire bonding: bonding on copper
Proceedings paper2002, Proceedings of the European Microelectronics Packaging and Interconnection Symposium - IMAPS-EUROPE, 16/06/2002, p.27-32Publication Bonding on Cu: a new stress evaluation approach by Raman spectroscopy
Proceedings paper2002, Proceedings 4th Electronics Packaging Technology Conference, 10/12/2002, p.60-64Publication Copper wire bonding to advanced copper back-end integrated circuits
Oral presentation2003, Semicon Europe, Advanced Packaging SeminarPublication Direct Au and Cu wire bonding on Cu/Low-k BEOL
Proceedings paper2002, Proceedings 4th Electronics Packaging Technology Conference, 10/12/2002, p.344-349Publication Fine pitch copper wire bonding on copper bond pad process optimization
Proceedings paper2002, 4th International Symposium on Electronic Materials and Packaging, 3/12/2002, p.63-68