Browsing by Author "Liang, Jie"
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Publication A Modeling Study of Stacked Cu-CNT TSV on Electrical, Thermal, and Reliability Analysis
Journal article2024, IEEE TRANSACTIONS ON ELECTRON DEVICES, (71) 1, p.184-191Publication A Modeling Study on Electrical and Thermal Behavior of CNT TSV for Multilayer Structure
Journal article2023, IEEE TRANSACTIONS ON ELECTRON DEVICES, (70) 9, p.4779-4785Publication Carbon Nanotube SRAM in 5-nm Technology Node Design, Optimization, and Performance Evaluation--Part I: CNFET Transistor Optimization
Journal article2022, IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, (30) 4, p.432-439Publication Carbon Nanotube SRAM in 5-nm Technology Node Design, Optimization, and Performance Evaluation--Part II: CNT Interconnect Optimization
Journal article2022, IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, (30) 4, p.440-448Publication Enabling UTBB Strained SOI Platform for Co-integration of Logic and RF: Implant-Induced Strain Relaxation and Comb-like Device Architecture
Proceedings paper2020, IEEE Symposium on VLSI Technology and Circuits, JUN 15-19, 2020Publication Recent Progress and Challenges Regarding Carbon Nanotube On-Chip Interconnects
Journal article review2022, MICROMACHINES, (13) 7, p.1148