Browsing by Author "Lutter, Stefan"
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Publication Development of multi-stack dielectric wafer bonding
Proceedings paper2016, 17th International Conference on Electronic Packaging Technology - ICEPT, 16/08/2016, p.22-25Publication Extremely low force debonding of thinned CMOS substrate by laser release of a temporary bond material
; ; ; ; ; Proceedings paper2016, IEEE 66th Electronic Components and Technology Conference - ECTC, 31/05/2016, p.1685-1690Publication The growing applilcation field of laser debonding: from advanced packaging to future nanoelectronics
Proceedings paper2019, 2019 International Wafer Level Packaging Conference (IWLPC), 13/10/2019