Browsing by Author "Malachowski, Karl"
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Publication A detailed study of a novel wafer separation method for surface sensitive MEMS wafers
Oral presentation2011, MRS Fall Meeting Symposium TT: Microelectromechanical Systems: Materials and Devices VPublication An investigation into damage-free thin die pick and place for 3D stacking
Proceedings paper2011-12, 13th Electronics Packaging Technology Conference - EPTC, 7/12/2011Publication Biocompatible and flexible packaging for implantable electronic devices
Meeting abstract2011, 3rd Flexible & Stretchable Electronics Workshop, 15/11/2011Publication Biocompatible chip and system packaging for implantable applications
Proceedings paper2012, 4th International Conference on Smart Materials, Structures and Systems - CIMTEC, 10/06/2012Publication Biocompatible encapsulation and interconnection technology for implantable electronic devices
Proceedings paper2012, IMAPS 45th International Conference and Exhibition on Microelctronics, 10/09/2012, p.215-224Publication Biocompatible packaging for implant medical devices
Meeting abstract2011, IEEE EMBS Benelux Chapter, 1/12/2011Publication Design and characterization of a biocompatible packaging concept for implantable electronic devices
Journal article2012, Journal of Microelectronics and Electronic Packaging, (9) 1, p.43-50Publication Design and characterization of a biocompatible packaging concept for implantable electronic devices
Proceedings paper2011, IMAPS 44th International Symposium on Microelectronics, 9/10/2011Publication Development of a biocompatible encapsulation and interconnect technology for implantable electronics
; ; Publication Development of cost-effective biocompatible packaging for microelectronic devices
Proceedings paper2011-09, 33rd Annual International Conference of the IEEE Engineering in Medicine and Biology Society - EMBC, 30/08/2011, p.7674-7677Publication Evaluation of backside passivation using laser annealing in backside illuminated image sensors
Oral presentation2013, Workshop CMOS Image Sensors for High Performance ApplicationsPublication New hermetic packaging concept for implantable medical devices
Proceedings paper2011, IMAPS Advanced Technology Workshop on Microelectronic Packaging and Materials for Medical Devices, 14/06/2011Publication Novel minaturized packaging for implantable electronic devices
Proceedings paper2012, IEEE International Interconnect Technology Conference - IITC, 4/06/2012Publication Process integration study of packaging materials for implant applications
Meeting abstract2013, MRS Spring Meeting Symposium SS: Bioelectronics - Materials, Interfaces, and Applications, 1/04/2013, p.SS3.19Publication Reliability study of reference semiconductor encapsulation materials for biocompatible packaging
Proceedings paper2012, IMAPS 45th International Symposium on Microelectronics, 9/09/2012, p.148-153Publication Wafer level integration of plasmonic nanopore arrays into 200mm CMOS fab environment
Meeting abstract2012, 4. GMM Mikro-Nano-Integration Workshop, 12/11/2012Publication Wafer scale processing of plasmonic nanopore arrays in 200mm CMOS fab environment
; ; Publication Wafer scale processing of plasmonic nanoslit arrays in 200mm CMOS fab environment
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