Browsing by Author "Matsuki, N."
Now showing 1 - 3 of 3
- Results Per Page
- Sort Options
Publication Characterization and integration in Cu damascene structures of AURORA, an inorganic low-k dielectric
Proceedings paper2001, Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics, 23/04/2000, p.D5.14.1-D5.14-6Publication Characterization of PVD TaN and ALD WNxCy copper diffusion barriers on a porous CVD low-k material
Proceedings paper2004, Advanced Metallization Conference 2003, 21/10/2003, p.723-728Publication Highly reliable Cu/ULK integratrion scheme using MHM and low-k capping film
Oral presentation2007, Advanced Metallization Conference - AMC