Browsing by Author "McCutcheon, Jeremy"
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Publication Integration and manufacturing aspects of moving from HT-10.10 to ZoneBOND™ in temporary wafer bonding and debonding for 3D applications
Proceedings paper2013, IEEE 63rd Electronic Components and Technology Conference - ECTC, 28/05/2013, p.113-117Publication Process characterization of thin wafer debonding with thermoplastic materials
Proceedings paper2012, 4th Electronics System Integration technologies Conference - ESTC, 17/09/2012Publication Ultrathin wafer handling in 3D stacked IC manufacturing combining a novel zoneBOND™ temporary bonding process with room temperature peel debonding
Proceedings paper2012, IEEE International 3D Systems Integration Conference - 3DIC, 31/01/2012