Browsing by Author "Moeller, Berthold"
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Publication Edge trimming for surface activated dielectric bonded wafers
; ; ; ; Publication Edge trimming for wafer-to-wafer 3D integration
Proceedings paper2016, Materials for Advanced Metallization Conference - MAM, 20/03/2015, p.P3D-03Publication Polymer and bump planarization for fine pitch micro-bump stacking
Meeting abstract2018, AiMES2018 Meeting G05-Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density ..., 30/09/2018, p.1135