Browsing by Author "Nabiollahi, Nabi"
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Publication Impact of Cu TSVs on BEOL metal and dielectric reliability
Proceedings paper2014, International Reliability Physics Symposium - IRPS, 1/06/2014, p.3E.1.1-3E.1.5Publication Impact of oxide liner properties on TSV Cu pumping and TSV stress
Proceedings paper2015, IEEE International Reliability Physics Symposium - IRPS, 19/04/2015, p.4C.5Publication Microstructure simulation of grain growth in Cu Through Silicon Via using phase-field modeling
Proceedings paper2014, 15th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE, 7/04/2014, p.1-4Publication Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling
Journal article2015, Microelectronics Reliability, (55) 5, p.765-770Publication Processing Induced Changes of Mechanical Stresses in and near Cu Through Silicon Vias (TSVs): A Finite Element Modelling Study
Nabiollahi, NabiPHD thesis2017-12Publication Simulation of Cu pumping during TSV fabrication
Proceedings paper2013, IEEE Int. Conf on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsyst. - EuroSimE, 14/04/2013