Browsing by Author "Naeim, Mohamed"
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Publication Bandwidth-Latency-Thermal Co-Optimization of Interconnect-Dominated Many-Core 3D-IC
Journal article2025, IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, (33) 2, p.346-357Publication Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs
Proceedings paper2023, IEEE International 3D Systems Integration Conference (3DIC), MAY 10-12, 2023Publication Iterative Layout-Aware Power, Thermal, and IR-Drop Co-Optimization: Ensuring Convergency in 3D-ICs
Journal article2025, IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, (15) 4, p.648-658Publication Multidie 3-D Stacking of Memory Dominated Neuromorphic Architectures
Journal article2024, IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, (32) 11, p.2144-2148Publication System-Technology Co-Optimization for Dense Edge Architectures Using 3-D Integration and Nonvolatile Memory
Journal article2024, IEEE JOURNAL ON EXPLORATORY SOLID-STATE COMPUTATIONAL DEVICES AND CIRCUITS, 10, p.125-134Publication Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-core RISC-V SoC
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