Browsing by Author "Oba, Yoshiyuki"
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Publication Effect of test structure on electromigration characteristics in 3D-TSV stacked devices
Proceedings paper2014, Advanced Metallization Conference - ADMETA: 24th Asian Session, 22/10/2014Publication Effect of test structure on electromigration characteristics in 3D-TSV stacked devices
Journal article2015, Japanese Journal of Applied Physics, (54) 5S, p.05EE01Publication Hydrogen outgassing induced liner barrier reliability degradation in through silicon via's
; ; ; ; Journal article2014, Applied Physics Letters, (104) 14, p.142906Publication Impact of barrier integrity on liner reliability in 3D through silicon vias
Proceedings paper2013, IEEE International Reliability Physics Symposium - IRPS, 14/04/2013, p.5C.5