Browsing by Author "Pinho, Nelson"
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Publication Advances in Photosensitive Polymer Based Damascene RDL Processes: Toward Submicrometer Pitches With More Metal Layers
Proceedings paper2021, IEEE 71st Electronic Components and Technology Conference (ECTC), JUN 01-JUL 04, 2021, p.340-346Publication Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G
Proceedings paper2022, 72nd IEEE Electronic Components and Technology Conference (ECTC), MAY 31-JUN 01, 2022, p.7-11Publication III-V/III-N technologies for next generation high-capacity wireless communication
Proceedings paper2022, International Electron Devices Meeting (IEDM), DEC 03-07, 2022Publication Inorganic capping layers in advanced photosensitive polymer based RDL processes: processing and reliability
Proceedings paper2023, IEEE 73rd Electronic Components and Technology Conference (ECTC), MAY 30-JUN 02, 2023, p.2040-2045Publication Inorganic Capping Layers in RDL Technologies: Process Advantages and Reliability
Journal article2023, JOM, (75) 12, p.5096-5102Publication Process development for a novel low loss and non-PFAS photo imageable dielectric for RF silicon interposer applications
Proceedings paper2024, 2024 International 3D Systems Integration Conference, SEP 25-27, 2024Publication Reliability Investigations of Advanced Photosensitive Polymer based RDL Processes Protected by Inorganic Capping Layers
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.647-653Publication Semi-Additive Fine Pitch RDL Litho-Process Development of 1000nm CD using low-NA 300mm i-line Stepper
Proceedings paper2024, 10th IEEE Electronics System-Integration Technology Conference (ESTC), SEP 11-13, 2024Publication Ultra-Fine Pitch RDL (UFPRDL) using Polymer Dual Damascene processing
Proceedings paper2023, IEEE 73rd Electronic Components and Technology Conference (ECTC), MAY 30-JUN 02, 2023, p.1364-1368