Browsing by Author "Plach, Thomas"
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Publication A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage
; ; ; ; Publication Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers
Proceedings paper2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.386-393