Browsing by Author "Rack, Martin"
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Publication Contribution of Substrate Harmonic Distortion to GaN-on-Si RF Switches Linearity
Journal article2024, IEEE MICROWAVE AND WIRELESS TECHNOLOGY LETTERS, (34) 3, p.298-301Publication Fast and accurate modeling of large TSV arrays in 3D-ICs using a 3D circuit model validated against full-wave FEM simulations and RF measurements
Proceedings paper2016, IEEE 66th Electronic Components and Technology Conference - ECTC, 31/05/2015, p.966-971Publication Investigation of TSV noise coupling in 3D-ICs using an experimental validated 3D TSV circuit model including Si substrate effects and TSV capacitance inversion behavior after wafer thinning
Proceedings paper2016, IEEE MTT-S International Microwave Symposium - IMS, 22/05/2016, p.1-4Publication Modeling the effect of charges in the back side passivation layer on through silicon via (TSV) capacitance after wafer thinning
Proceedings paper2015, IEEE MTT-S International Microwave Symposium - IMS, 17/05/2015, p.1-4Publication Time Dependence of RF Losses in GaN-on-Si Substrates
Journal article2022-04-11, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, (32) 6, p.688-691