Browsing by Author "Shingubara, Shoso"
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Publication Development of glyoxylic acid based electroless copper deposition on ruthenium
Meeting abstract2014, 226th Fall Meeting of the Electrochemical Society, 5/10/2014, p.1701Publication Development of glyoxylic acid based electroless copper deposition on ruthenium
Proceedings paper2015, Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6, 5/10/2014, p.41-55Publication Electroless copper bath stability monitoring with UV-VIS spectroscopy, pH, and mixed potential measurements
Journal article2012, Journal of the Electrochemical Society, (159) 7, p.D437-D441Publication Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
Journal article2013, Electrochimica Acta, 100, p.203-211Publication Glyoxylic acid as reducing agent for electroless copper deposition on cobalt liner
Proceedings paper2015, Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6, 5/10/2014, p.63-75Publication Low temperature through-Si via fabrication using electroless deposition
Proceedings paper2012, IEEE International 3D System Integration Conference - 3DIC, 31/01/2012, p.1-4Publication Novel seed layer formation using direct electroless copper deposition on ALD-Ru layer for high aspect ratio TSV
Proceedings paper2012, IEEE International Interconnect Technology Conference - IITC, 4/06/2012