Browsing by Author "Siau, S."
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Publication Adhesion strength of the epoxy polymer/copper interface for use in microelectronics
Journal article2005, Journal of the Electrochemical Society, (152) 6, p.c442-c455Publication Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper
Journal article2005, Journal of the Electrochemical Society, (152) 9, p.d136-d150Publication Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes
Journal article2005, Applied Surface Science, (245) 1, p.353-368Publication Interface evolution of epoxy layers due to wet-chemical treatments and its relevance to adhesion of electrochemically deposited copper
Meeting abstract2005-05, Meeting Abstracts of the 207th meeting of The Electrochemical Society, 15/05/2005, p.348Publication Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards
Journal article2004, Microelectronic ReliabilityPublication The development of epoxy polymer surface roughness due to wet chemical treatments and its relevance to adhesion of electrochemically deposited copper
Proceedings paper2005-06, 5th International Symposium on Polymer Surface Modification, 20/06/2005, p.22