Browsing by Author "Smith, Ken"
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Publication A full-automatic test system for characterizing wide-I/O micro-bump probe cards
; ; ; ;Kiesewetter, Joerg ;Hill, EricSmith, KenProceedings paper2017-06, IEEE Semiconductor Wafer Test Workshop - SWTW, 4/06/2017, p.812-848Publication A fully automatic test system for characterizing large-array fine-pitch micro-bump probe cards
; ; ; ;Kiesewetter, Joerg ;Hill, EricSmith, KenProceedings paper2017-09, IEEE International Test Conference Asia - ITC-Asia, 13/09/2017Publication Direct probing on large-array fine-pitch micro-bumps of a wide-I/O logic-memory interface
Proceedings paper2014-10, Cascade Microtech COMPASS User Conference, 9/10/2014Publication Direct probing on large-array fine-pitch micro-bumps of a wide-I/O logic-memory interface
Proceedings paper2014-10, IEEE International Test Conference - ITC, 21/10/2014, p.1-10Publication Evaluation of advanced probe cards for large-array fine-pitch micro-bumps
; ; ; ;Kiesewetter, Joerg ;Smith, KenHill, EricJournal article2017-11, Chip Scale Review, (21) 6, p.16-20Publication Evaluation of TSV and micro-bump probing for wide I/O testing
Proceedings paper2011-09, IEEE International Test Conference - ITC, 20/09/2011Publication Probing of large-array, fine-pitch microbumps for 3D ICs
Proceedings paper2017-05, NI Week Engineering Impact Award, 22/05/2017, p.1-4Publication Test strategies for wide-I/O memory, 3D-TSV technology test vehicles and ultra-fine-pitch applications
Proceedings paper2012-11, IEEE International Workshop on Testing Three-Dimensional Stacked ICs - 3D-TEST, 8/11/2012Publication Wafer probing on fine-pitch micro-bumps for 2.5D- and 3D-SICs
Oral presentation2011, IEEE Semiconductor Wafer Test Workshop - SWTW