Browsing by Author "Sridhar, Ashok"
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Publication A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
Proceedings paper2012, 4th Electronics System Integration Technologies Conference - ESTC, 17/09/2012Publication Active and passive component embedding into low-cost plastic substrates aimed at smart system application
Proceedings paper2013, International Microelectronics Assembly and Packaging Society - IMAPS US, 1/10/2013Publication Flexible and stretchable electronics for wearable healthcare
Proceedings paper2014, 44th European Solid State Device Research Conference - ESSDERC, 22/09/2014, p.206-209Publication Flip-chip bonding of fine-pitch ultra-thin chips for SiF applications
Proceedings paper2014, Electronics System-Integration Technology Conference, 16/09/2014, p.1-5Publication High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies
;van den Ende, Daan ;Verhoeven, Frits ;van der Eijnden, Pepijn ;Kusters, RoelSridhar, AshokProceedings paper2013, European Microelectronics Packaging Conference, 9/09/2013Publication Integration techniques and applications of thin chips on low cost foil substrates
Proceedings paper2013, Smart Systems Integration, 13/03/2013Publication Mechanical and electrical propeties of ultra-thin chips and flexible electronics assemblies during bending
;van den Ende, Daan ;van de Wiel, H.J. ;Kusters, Roel ;Sridhar, Ashok ;Schram, JeroenJournal article2014, Microelectronics Reliability, (54) 12, p.2860-2870Publication Novel methodology to integrate ultra-thin chips on flexible foils
Proceedings paper2012, 4th Electronics System Integration technologies Conference - ESTC, 17/09/2012Publication Technology development for a flexible, low-cost backplane for lighting applications
Oral presentation2014, Imaps-Benelux Spring Event: Packaging for lighting and photonicsPublication Towards reel-to-reel integration of ultra thin chips to polymer foils
Proceedings paper2012, 4th Electronics System Integration Technologies Conference - ESTC, 17/09/2012