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Browsing by Author "Sridhar, Ashok"

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    A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels

    Cauwe, Maarten  
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    Vandecasteele, Bjorn  
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    De Baets, Johan  
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    van den Brand, Jeroen
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    Kusters, Roel
    Proceedings paper
    2012, 4th Electronics System Integration Technologies Conference - ESTC, 17/09/2012
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    Active and passive component embedding into low-cost plastic substrates aimed at smart system application

    Cauwe, Maarten  
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    Vandecasteele, Bjorn  
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    De Baets, Johan  
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    van den Brand, Jeroen
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    Kusters, Roel
    Proceedings paper
    2013, International Microelectronics Assembly and Packaging Society - IMAPS US, 1/10/2013
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    Flexible and stretchable electronics for wearable healthcare

    van den Brand, Jeroen
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    de Kok, Margreet
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    Sridhar, Ashok
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    Cauwe, Maarten  
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    Verplancke, Rik  
    Proceedings paper
    2014, 44th European Solid State Device Research Conference - ESSDERC, 22/09/2014, p.206-209
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    Flip-chip bonding of fine-pitch ultra-thin chips for SiF applications

    Kusters, Roel
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    Sridhar, Ashok
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    Cauwe, Maarten  
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    van den Brand, Jeroen
    Proceedings paper
    2014, Electronics System-Integration Technology Conference, 16/09/2014, p.1-5
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    High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies

    van den Ende, Daan
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    Verhoeven, Frits
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    van der Eijnden, Pepijn
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    Kusters, Roel
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    Sridhar, Ashok
    Proceedings paper
    2013, European Microelectronics Packaging Conference, 9/09/2013
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    Integration techniques and applications of thin chips on low cost foil substrates

    van den Ende, Daan
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    Sridhar, Ashok
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    van den Brand, Jeroen
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    Cauwe, Maarten  
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    Vandecasteele, Bjorn  
    Proceedings paper
    2013, Smart Systems Integration, 13/03/2013
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    Mechanical and electrical propeties of ultra-thin chips and flexible electronics assemblies during bending

    van den Ende, Daan
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    van de Wiel, H.J.
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    Kusters, Roel
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    Sridhar, Ashok
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    Schram, Jeroen
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    Cauwe, Maarten  
    Journal article
    2014, Microelectronics Reliability, (54) 12, p.2860-2870
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    Novel methodology to integrate ultra-thin chips on flexible foils

    Sridhar, Ashok
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    Cauwe, Maarten  
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    Kusters, Roel
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    Fledderus, H
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    van den Brand, Jeroen
    Proceedings paper
    2012, 4th Electronics System Integration technologies Conference - ESTC, 17/09/2012
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    Technology development for a flexible, low-cost backplane for lighting applications

    Cauwe, Maarten  
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    Sridhar, Ashok
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    Sterken, Tom  
    Oral presentation
    2014, Imaps-Benelux Spring Event: Packaging for lighting and photonics
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    Technology development for a flexible, low-cost backplane for lighting applications

    Cauwe, Maarten  
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    Sridhar, Ashok
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    Sterken, Tom  
    Oral presentation
    2014, Smart Lighting
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    Towards reel-to-reel integration of ultra thin chips to polymer foils

    Tichem, Marcel
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    Cauwe, Maarten  
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    Hajdarevic, Zlatko
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    Kuran, Eda
    ;
    Naveh, Benny
    ;
    Sridhar, Ashok
    Proceedings paper
    2012, 4th Electronics System Integration Technologies Conference - ESTC, 17/09/2012

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