Browsing by Author "Tanaka, Tetsu"
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Publication Conformal Cu electroless seed on Co and Ru liners enables Cu fill by plating for advanced interconnects
Meeting abstract2016, 25th Advanced Materials for Metalization Conference - MAM, 21/03/2016, p.MT1Publication Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias
Proceedings paper2014, IEEE 3D System Integration Conference - 3DIC, 1/12/2014, p.1-4Publication Development of glyoxylic acid based electroless copper deposition on ruthenium
Proceedings paper2015, Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6, 5/10/2014, p.41-55Publication Development of glyoxylic acid based electroless copper deposition on ruthenium
Meeting abstract2014, 226th Fall Meeting of the Electrochemical Society, 5/10/2014, p.1701Publication Electroless Cu seed on Ru and Co liners in high aspect ratio TSV
Proceedings paper2014, IEEE International Interconnect Technology Conference / Advanced Metallization Conference - IITC/AMC, 20/05/2014, p.207-210Publication Glyoxylic acid as reducing agent for electroless copper deposition on cobalt liner
Proceedings paper2015, Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6, 5/10/2014, p.63-75Publication Glyoxylic acid as reducing agent for electroless copper deposition on cobalt liner
Meeting abstract2014, 226th Meeting Fall of the Electrochemical Society, 5/10/2014, p.1703Publication Nucleation kinetics of electroless Cu deposition on ruthenium using glyoxylic acid as reducing agent
Journal article2014, Journal of the Electrochemical Society, (161) 14, p.D768-D774Publication Role of bath composition in electroless Cu seeding on Co liner for through-Si vias
Journal article2015-01, ECS Journal of Solid State Science and Technology, (4) 1, p.N3108-N3112