Browsing by Author "Tussing, Sebastian"
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Publication Acoustic modulation during laser debonding of collective hybrid bonded dies
Proceedings paper2021, IEEE 71st Electronic Components and Technology Conference (ECTC), JUN 01-JUL 04, 2021, p.2126-2133Publication Carrier Systems for Collective Die-to-Wafer Bonding
Proceedings paper2022, 72nd IEEE Electronic Components and Technology Conference (ECTC), MAY 31-JUN 01, 2022, p.2058-2063Publication The growing applilcation field of laser debonding: from advanced packaging to future nanoelectronics
Proceedings paper2019, 2019 International Wafer Level Packaging Conference (IWLPC), 13/10/2019