Browsing by Author "Van Dijk, Leon"
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Publication Intra-field stress impact on global wafer deformation
Proceedings paper2019, Metrology, Inspection, and Process Control for Microlithography XXXIII, 24/02/2019, p.109591IPublication On product overlay characterization after stressed layer etch
Proceedings paper2021, Advanced Etch Technology and Process Integration for Nanopatterning X, 21/02/2021, p.116150NPublication The impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay
; ; Publication The impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay
; ; Publication Wafer alignment mark placement accuracy impact on the layer to layer overlay performance
; ; Publication Wafer shape based in-plane distortion predictions using superfast 4G metrology
Proceedings paper2017, Metrology, Inspection, and Process Control for Microlithography XXXI,, 31/01/2017, p.101452L