Browsing by Author "Vandepitte, D."
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Publication Analytical thermo-mechanical model for non-underfilled area array flip chip assemblies
Journal article2004-09, Journal of Electronic Packaging, (126) 3, p.351-358Publication Influence of printed circuit board properties on solder joint fatigue life of assembled IC packages
Proceedings paper2004, Proceedings European Microelectronics Packaging Symposium (IMAPS Europe), 16/06/2004, p.65-70Publication Modified micro-macro thermo-mechanical modelling of ceramic ball grid array packages
; ; Publication Parameter study for the reliability of underfilled flip chip and CSP assemblies
Proceedings paper2002, Proceedings of the European Microelectronics Packaging and Interconnection Symposium - IMAPS-EUROPE, 14/06/2002, p.130-135Publication Parameterised modelling of thermo-mechanical reliability for CSP assemblies
Journal article2003, ASME Journal of Electronic Packaging, (125) 4, p.498-805Publication Semi-analytical model for calculation of induced strains in solder joints of underfilled flip chip assemblies
Journal article2002, International Journal of Microcircuits and Electronic Packaging, (25) 3, p.264-278Publication Semi-analytical model for calculation of induced strains in solder joints of underfilled flip chip assemblies
Proceedings paper2002, Proceedings of the 3rd Eurosime Conference, 14/04/2002, p.86-91Publication Solder parameter sensitivity for CSP life-time prediction using simulation-based optimisation method
Journal article2002, IEEE Trans. Electronics Packaging Manufacturing, (25) 4, p.318-325Publication Thermomechanical models for leadless solder interconnections in flip chip assemblies
Journal article1998, IEEE Trans. Components, Packaging, and Manufacturing Technology. Part A, (21) 1, p.177-85