Browsing by Author "Vervaet, A."
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Publication Adhesion strength of the epoxy polymer/copper interface for use in microelectronics
Journal article2005, Journal of the Electrochemical Society, (152) 6, p.c442-c455Publication ASIC chip, hybrid multisensor, and package co-design for smart gas monitoring module
Publication Cheap multichip modules
Journal article1999, Informacije Midem - Journal of Microelectronics electronic components and materials, (29) 2, p.71-78Publication Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper
Journal article2005, Journal of the Electrochemical Society, (152) 9, p.d136-d150Publication Combining inorganic and organic gas sensor elements: a new approach for multicomponent sensing
Publication Combining inorganic and organic sensor elements: a new approach for multi-component sensing
Publication Determination of the state-of-health of VRLA batteries by means of noise measurements
Publication Dip coating of dielectric and solder mask epoxy polymer layers for build-up purposes
Journal article2005, Applied Surface Science, (245) 1, p.353-368Publication Electroless nickel-gold stud bumping on laminate for flip-chip assembly
; Publication Excimer laser microvia technology in MCMs
Oral presentation2002, E-MRS Spring Meeting Symposium D: Physics and Chemistry of Laser Materials ProcessingPublication Excimer laser microvia-technology in multichip modules
Journal article2003, Applied Surface Science, 208-209, p.171-176Publication Highlights of the dactel project: development of adhesive flip-chip technologies for dedicated electronic applications
Proceedings paper2000, Proceedings of the 23rd International Spring Seminar on Electronics Technology; May 2000; Balatonfured, Hungary., p.315-318Publication Influence of build-up epoxy layer surface roughness on the adhesion strength of electrochemically deposited copper
Meeting abstract2004, 205th Meeting of the Electrochemical Society. Meeting Abstracts, 9/05/2004, p.207Publication Interface evolution of epoxy layers due to wet-chemical treatments and its relevance to adhesion of electrochemically deposited copper
Meeting abstract2005-05, Meeting Abstracts of the 207th meeting of The Electrochemical Society, 15/05/2005, p.348Publication Lead-acid battery model for the derivation of Peukert's law
Publication Low cost prototyping of multichip modules
Proceedings paper1999, Proceedings of the 5th European Conference on Multichip Modules; February 1999; London, UK., p.35-47Publication Low cost prototyping of multichip modules - the European INCO-Copernicus project
Journal article1999, Microelectronics International (Hybrid Circuits), (16) 2, p.13-19Publication New perspectives of selective gas sensing: combining electroconducting polymers with thick and thin films
Publication Small bandwith measurement of the noise voltage of batteries
Publication Stabilizer concentration and local environment: their effects on electroless nickel plating of PCB micropads
Journal article1999, J. Electrochem. Soc., (146) 8, p.2870-2875