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Browsing by Author "Wan, Danny"

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    3D interconnects for quantum computing

    Derakhshandeh, Jaber  
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    Dangol, Anish  
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    Hussain, Tassawar  
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    Stegmann, Heiko
    Proceedings paper
    2024, IEEE 74th Electronic Components and Technology Conference (ECTC), MAY 28-31, 2024, p.821-828
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    Advanced CMOS manufacturing of superconducting qubits on 300 mm wafers

    Van Damme, Jacques  
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    Massar, Shana  
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    Acharya, Rohith  
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    Ivanov, Tsvetan  
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    Perez Lozano, Daniel  
    Journal article
    2024, NATURE, (634) 8032, p.74-79
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    All-Electrical Control of Scaled Spin Logic Devices Based on Domain Wall Motion

    Raymenants, Eline  
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    Wan, Danny  
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    Couet, Sebastien  
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    Souriau, Laurent  
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    Thiam, Arame  
    Journal article
    2021, IEEE TRANSACTIONS ON ELECTRON DEVICES, (68) 4, p.2116-2122
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    All-electrical control of scaled spin logic devices based on domain wall motion

    Raymenants, Eline  
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    Wan, Danny  
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    Couet, Sebastien  
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    Souriau, Laurent  
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    Thiam, Arame  
    Proceedings paper
    2020, IEEE International Electron Devices Meeting (IEDM), DEC 12-18, 2020
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    Argon-Milling-Induced Decoherence Mechanisms in Superconducting Quantum Circuits

    Van Damme, Jacques  
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    Ivanov, Tsvetan  
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    Favia, Paola  
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    Conard, Thierry  
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    Verjauw, Jeroen  
    Journal article
    2023, PHYSICAL REVIEW APPLIED, (20) 1, p.Art. 014034
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    Chain of magnetic tunnel junctions as a spintronic memristor

    Raymenants, Eline  
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    Vaysset, Adrien
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    Wan, Danny  
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    Manfrini, Mauricio  
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    Zografos, Odysseas  
    Journal article
    2018, Journal of Applied Physics, (124) 15, p.152116
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    CMOS compatible Josephson junctions for superonducting qubit applications

    Ivanov, Tsvetan  
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    Potocnik, Anton  
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    Wan, Danny  
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    Verjauw, Jeroen  
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    Jussot, Julien  
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    Mongillo, Massimo  
    Meeting abstract
    2020, 2020 International Conference on Solid State Devices and Materials - SSDM, 27/09/2020, p.I-4-02
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    Compressively strained epitaxial Ge layers for quantum computing applications

    Shimura, Yosuke  
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    Godfrin, Clement  
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    Hikavyy, Andriy  
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    Li, Roy  
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    Aguilera, Juan
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    Katsaros, Georgios
    Journal article
    2024, MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 174, p.Art. 108231
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    Demonstration of 99.9% single qubit control fidelity of a silicon quantum dot spin qubit made in a 300 mm foundry process

    Dumoulin Stuyck, N.
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    Feng, M. K.
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    Lim, W. H.
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    Serrano Ramirez, S.
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    Escott, C. C.
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    Botzem, T.
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    Tanttu, T.
    Proceedings paper
    2024, IEEE Silicon Nanoelectronics Workshop (SNW) / Symposium on VLSI Technology and Circuits, 2024-06-15, p.11-12
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    Direct metal etch evaluation for advanced interconnect

    Paolillo, Sara  
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    Lazzarino, Frederic  
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    Rassoul, Nouredine  
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    Wan, Danny  
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    Piumi, Daniele  
    Proceedings paper
    2017, AVS 64th International Symposium & Exhibition, 29/10/2017, p.PS-WeM2
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    Direct metal etch for advanced interconnect

    Paolillo, Sara  
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    Wan, Danny  
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    Lazzarino, Frederic  
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    Rassoul, Nouredine  
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    Piumi, Daniele  
    Journal article
    2018, Journal of Vacuum Science and Technology B, (36) 3, p.3.00E+103
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    Electrical comparison of iN7 EUV hybrid and EUV single patterning BEOL metal layers

    Lariviere, Stephane  
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    Wilson, Chris  
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    Kutrzeba Kotowska, Bogumila  
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    Versluijs, Janko  
    Proceedings paper
    2018, Extreme Ultraviolet (EUV) Lithography IX, 25/02/2018, p.105830U
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    Fabrication and room temperature characterization of trilayer junctions for the development of 300 mm compatible superconducting qubits

    Wan, Danny  
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    Couet, Sebastien  
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    Piao, Xiaoyu  
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    Souriau, Laurent  
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    Tsvetanova, Diana  
    Meeting abstract
    2020, 2020 International Conference on Solid state Devices and Materials - SSDM, 27/09/2020, p.I-4-03
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    Fabrication and room temperature characterization of trilayer junctions for the development of superconducting qubits on 300 mm wafers

    Wan, Danny  
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    Couet, Sebastien  
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    Piao, Xiaoyu  
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    Souriau, Laurent  
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    Canvel, Yann  
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    Tsvetanova, Diana  
    Journal article
    2021, JAPANESE JOURNAL OF APPLIED PHYSICS, (60) SB, p.SBB104
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    Fabrication of magnetic tunnel junctions connected through a continuous free layer to enable spin logic devices

    Wan, Danny  
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    Manfrini, Mauricio  
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    Vaysset, Adrien
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    Souriau, Laurent  
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    Wouters, Lennaert  
    Journal article
    2018, Japanese Journal of Applied Physics, (57) 4S, p.04FN01
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    Fabrication of Superconducting Nb Airbridges in a 300 mm Pilot Line for Quantum Technologies

    Wan, Danny  
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    Mongillo, Massimo  
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    Canvel, Yann  
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    Perez Lozano, Daniel  
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    Tobback, Bert  
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    Ivanov, Tsvetan  
    Proceedings paper
    2024, 2024 International Interconnect Technology Conference, JUN 03-06, 2024
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    Fabrication of superconducting resonators in a 300 mm pilot line for quantum technologies

    Wan, Danny  
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    Swerts, Johan  
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    Souriau, Laurent  
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    Burnett, Jonathan
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    Piao, Xiaoyu  
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    Mongillo, Massimo  
    Meeting abstract
    2019, IEEE International Interconnect Technology Conference (IITC 2019) and Materials for Advanced Metallization Conference (MAM 2019), 3/06/2019, p.10.2
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    High-Performance 300mm Integrated Superconducting Resonators for Quantum Computing Applications

    Mongillo, Massimo  
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    Potocnik, Anton  
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    Verjauw, Jeroen  
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    Mohiyaddin, Fahd Ayyalil  
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    Ivanov, Tsvetan  
    Proceedings paper
    2021, IEEE International Electron Devices Meeting (IEDM), DEC 11-16, 2021
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    Industrial 300 mm wafer processed spin qubits in natural silicon/silicon-germanium

    Koch, Thomas
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    Godfrin, Clement
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    Adam, Viktor
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    Ferrero, Julian
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    Schroller, Daniel
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    Glaeser, Noah
    Journal article
    2025-APR 5, NPJ QUANTUM INFORMATION, (11) 1
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    Integration of interconnected magnetic tunnel junctions for spin torque majority gates

    Wan, Danny  
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    Manfrini, Mauricio  
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    Souriau, Laurent  
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    Sayan, Safak
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    Jussot, Julien  
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    Swerts, Johan  
    Proceedings paper
    2017, 49th International Conferece on Solid State Devices and Materials - SSDM, 19/09/2017
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