Browsing by Author "van den Ende, Daan"
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Publication Flipchip bonding of thin Si dies onto PET foils: possibilities and applications
Proceedings paper2011, Proceedings of the 18th European Microelectronics and Packaging Conference - EMPC, 12/09/2011Publication High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies
Publication Integration techniques and applications of thin chips on low cost foil substrates
Proceedings paper2013, Smart Systems Integration, 13/03/2013Publication Large area flexible lighting foils using distributed bare LED dies on polyester substrates
Journal article2013, Microelectronics Reliability, (53) 12, p.1907-1915Publication Mechanical and electrical propeties of ultra-thin chips and flexible electronics assemblies during bending
Publication Photonic flash soldering of thin chips and SMD components on foils for flexible electronics
Journal article2014, IEEE Transactions on Components, Packaging and Manufacturing Technology, (4) 11, p.1879-1886