Browsing by author "Malachowski, Karl"
Now showing items 1-18 of 18
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A detailed study of a novel wafer separation method for surface sensitive MEMS wafers
Malachowski, Karl; Severi, Simone; Van Hoof, Rita; Sangameswaran, Sandeep; Witvrouw, Ann; Genda, Satoshi; Tabuchi, Tomotaka; Uchiyama, Naoki (2011) -
An investigation into damage-free thin die pick and place for 3D stacking
Malachowski, Karl; Gonzales, Dennis; Miller, Andy; La Manna, Antonio; Hajdarevic, Zlatko; Schnegg, Fabian; Arzberger, Anton (2011-12) -
Biocompatible and flexible packaging for implantable electronic devices
Qian, Karen; Op de Beeck, Maaike; Malachowski, Karl; Miyazaki, Tomokazu; O'Callaghan, John; Van Hoof, Chris (2011) -
Biocompatible chip and system packaging for implantable applications
Op de Beeck, Maaike; Qian, Karen; O'Callaghan, John; Malachowski, Karl; Van Hoof, Chris (2012) -
Biocompatible encapsulation and interconnection technology for implantable electronic devices
Op de Beeck, Maaike; O'Callaghan, John; Qian, Karen; Morcos, Bishoy; Radisic, Alex; Malachowski, Karl; Amira, M-F.; Van Hoof, Chris (2012) -
Biocompatible packaging for implant medical devices
Qian, Karen; Op de Beeck, Maaike; Malachowski, Karl; O'Callaghan, John; Van Hoof, Chris (2011) -
Design and characterization of a biocompatible packaging concept for implantable electronic devices
Op de Beeck, Maaike; Qian, Karen; Fiorini, Paolo; Malachowski, Karl; Van Hoof, Chris (2012) -
Design and characterization of a biocompatible packaging concept for implantable electronic devices
Op de Beeck, Maaike; Qian, Karen; Malachowski, Karl; Fiorini, Paolo; Van Hoof, Chris (2011) -
Development of a biocompatible encapsulation and interconnect technology for implantable electronics
Op de Beeck, Maaike; Qian, Karen; Morcos, Bishoy; Radisic, Alex; Malachowski, Karl; Van Hoof, Chris (2013) -
Development of cost-effective biocompatible packaging for microelectronic devices
Qian, Karen; Malachowski, Karl; Fiorini, Paolo; Velenis, Dimitrios; Op de Beeck, Maaike; Van Hoof, Chris (2011-09) -
Evaluation of backside passivation using laser annealing in backside illuminated image sensors
Minoglou, Kiki; De Munck, Koen; Malachowski, Karl; Sabuncuoglu Tezcan, Deniz; Everaert, Jean-Luc; Haspeslagh, Luc; Mazzamuto, Fulvio; Toqué-Trésonne, Ines; Huet, Karim; De Moor, Piet (2013) -
New hermetic packaging concept for implantable medical devices
Qian, Karen; Fiorini, Paolo; Loo, Josine; Malachowski, Karl; Op de Beeck, Maaike; Van Hoof, Chris (2011) -
Novel minaturized packaging for implantable electronic devices
Qian, Karen; Op de Beeck, Maaike; Bryce, George; Malachowski, Karl; Van Hoof, Chris (2012) -
Process integration study of packaging materials for implant applications
Malachowski, Karl; O'Callaghan, John; Lagae, Liesbet; Braeken, Dries; Jans, Hilde; Miyazaki, Tomakazu; Sabuncuoglu Tezcan, Deniz (2013) -
Reliability study of reference semiconductor encapsulation materials for biocompatible packaging
Malachowski, Karl; Qian, Karen; Op de Beeck, Maaike; Verbeeck, Rita; Bryce, George; Dekkers, Harold; Sabuncuoglu Tezcan, Deniz (2012) -
Wafer level integration of plasmonic nanopore arrays into 200mm CMOS fab environment
Malachowski, Karl; Verbeeck, Rita; Dupont, Tania; Chen, Chang; Stakenborg, Tim; Li, Yi; Sabuncuoglu Tezcan, Deniz; Van Dorpe, Pol (2012) -
Wafer scale processing of plasmonic nanopore arrays in 200mm CMOS fab environment
Malachowski, Karl; Verbeeck, Rita; Dupont, Tania; Chen, Chang; Musa, Silke; Li, Yi; Stakenborg, Tim; Sabuncuoglu Tezcan, Deniz; Van Dorpe, Pol (2012) -
Wafer scale processing of plasmonic nanoslit arrays in 200mm CMOS fab environment
Malachowski, Karl; Verbeeck, Rita; Dupont, Tania; Chen, Chang; Li, Yi; Musa, Silke; Stakenborg, Tim; Sabuncuoglu Tezcan, Deniz; Van Dorpe, Pol (2012)