Browsing by author "Yu, Jengyi"
Now showing items 1-5 of 5
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Advanced metallization scheme for 3×50μm via middle TSV and beyond
Van Huylenbroeck, Stefaan; Li, Yunlong; Heylen, Nancy; Croes, Kristof; Beyer, Gerald; Beyne, Eric; Brouri, Mohand; Gopinath, Sanjay; Nalla, Praveen; Thorum, Matthew; Meshram, Prashant; Anjos, Daniela M.; Yu, Jengyi (2015) -
Continuity and reliability assessment of a scalable 3×50μm and 2×40μm Via-middle TSV module
Van Huylenbroeck, Stefaan; Li, Yunlong; Stucchi, Michele; Bogaerts, Lieve; De Vos, Joeri; Beyer, Gerald; Beyne, Eric; Brouri, Mohand; Nalla, Praveen; Gopinath, Sanjay; Thorum, Matthew; Richardson, Joe; Yu, Jengyi (2016) -
Dielectric liner reliability in via-middle through silicon vias with 3 micron diameter
Li, Yunlong; Van Huylenbroeck, Stefaan; Roussel, Philippe; Brouri, Mohand; Gopinath, Sanjaj; M. Anjos, Daniela; Thorum, Matthew; Yu, Jengyi; Beyer, Gerald; Beyne, Eric; Croes, Kristof (2016) -
Integrated approach to improving local CD uniformity in EUV patterning
Liang, Andrew; Hermans, Jan; Tran, Tim; Viatkina, Katja; Liang, Chen-Wei; Ward, Brandon; Chuang, Steven; Yu, Jengyi; Harm, Greg; Vandereyken, Jelle; Rio, David; Kubis, Michael; Tan, Samantha; Wise, Rich; Dusa, Mircea; Reddy, Sirish; Singhal, Akhil; Van Schravendijk, Bart; Dixit, Girish; Shamma, Nader (2017) -
Reliability study of liner/barrier/seed options for via-middle TSV's with 3m diameter and below
Li, Yunlong; Van Huylenbroeck, Stefaan; Roussel, Philippe; Brouri, Mohand; Gopinath, Sanjay; Anjos, Daniela M.; Thorum, Matthew; Yu, Jengyi; Beyer, Gerald; Beyne, Eric; Croes, Kristof (2015)