Browsing by author "Mao, Ming"
Now showing items 21-29 of 29
-
Organic- and QD-based image sensors integrated on 0.13 $lm CMOS ROIC for high resolution, multispectral infrared imaging
Georgitzikis, Epimitheas; Malinowski, Pawel; Li, Yunlong; Suss, Andreas; Frazzica, Fortunato; Maes, Jorick; Gielen, Sam; Verstraeten, Frederik; Boulenc, Pierre; Lee, Jiwon; Mao, Ming; Guerrieri, Stefano; Maes, Wouter; Hens, Zeger; Heremans, Paul; Cheyns, David (2019) -
Overlay metrology solutions in a triple patterning scheme
Leray, Philippe; Mao, Ming; Baudemprez, Bart; Amir, Nuriel (2015) -
SAQP and EUV block patterning of BEOL metal layers on IMEC's iN7 platform
Bekaert, Joost; Di Lorenzo, Paolo; Mao, Ming; Decoster, Stefan; Lariviere, Stephane; Franke, Joern-Holger; Blanco, Victor; Kutrzeba Kotowska, Bogumila; Lazzarino, Frederic; Gallagher, Emily; Hendrickx, Eric; Leray, Philippe; Kim, Ryan Ryoung han; McIntyre, Greg; Colsters, Paul; Wittebrood, Friso; van Dijk, Joep; Maslow, Mark; Timoshkov, Vadim; Kiers, Ton (2017) -
Single exposure EUV patterning for BEOL metal layers on the imec iN7 platform
Blanco, Victor; Bekaert, Joost; Mao, Ming; Kutrzeba Kotowska, Bogumila; Lariviere, Stephane; Ciofi, Ivan; Baert, Rogier; Kim, Ryan Ryoung han; Gallagher, Emily; Hendrickx, Eric; Tan, Ling Ee; Gillijns, Werner; Trivkovic, Darko; Leray, Philippe; Halder, Sandip; Gallagher, Matt; Lazzarino, Frederic; Paolillo, Sara; Wan, Danny; Mallik, Arindam; Sherazi, Yasser; McIntyre, Greg; Dusa, Mircea; Rusu, Paul; Hollink, Thijs; Fliervoet, Timon; Wittebrood, Friso (2017) -
Sub-40mV Sigma-VTH IGZO nFETs in 300mm Fab
Mitard, Jerome; Kljucar, Luka; Rassoul, Nouredine; Dekkers, Harold; van Setten, Michiel; Vaisman Chasin, Adrian; Pourtois, Geoffrey; Belmonte, Attilio; Donadio, Gabriele Luca; Goux, Ludovic; Mao, Ming; Puliyalil, Harinarayanan; Teugels, Lieve; Tsvetanova, Diana; Nag, Manoj; Steudel, Soeren; del Agua Borniquel, Jose Ignacio; Ramalingam, Jothilingam; Delhougne, Romain; Wilson, Chris; Tokei, Zsolt; Kar, Gouri Sankar (2020) -
Sub-µm a-IGZO, fully integrated, process improved, vertical diode for crosspoint arrays
Houshmand Sharifi, Shamin; Vaisman Chasin, Adrian; Fantini, Andrea; Dekkers, Harold; Mao, Ming; Nag, Manoj; Mertens, Sofie; Rao, Siddharth; Jossart, Nico; Crotti, Davide; Kar, Gouri Sankar (2020) -
The imec iN7 EUV platform: M2-Block and Via patterning developments
Bekaert, Joost; Franke, Joern-Holger; Mao, Ming; Lariviere, Stephane; Decoster, Stefan; Di Lorenzo, Paolo; Kutrzeba Kotowska, Bogumila; Blanco, Victor; Hendrickx, Eric; Gallagher, Emily; Leray, Philippe; Kim, Ryan Ryoung han; McIntyre, Greg; Colsters, Paul; Wittebrood, Friso; van Dijk, Joep; Timoshkov, Vadim; Kiers, Ton; Maslow, Mark (2016) -
Towards manufacturing a 10nm node device with complementary EUV lithography
Hermans, Jan; Dai, Huixiong; Niroomand, Ardavan; Laidler, David; Mao, Ming; Chen, Yongmei; Leray, Philippe; Ngai, Chris; Cheng, Shaunee (2013) -
Wafer level thin film image sensor integration
Li, Yunlong; Cheyns, David; Moreno Hagelsieb, Luis; Georgitzikis, Epimitheas; Lim, Myung jin; Mao, Ming; Boulenc, Pierre; Lee, Jiwon; Malinowski, Pawel; Sabuncuoglu Tezcan, Deniz; Guerrieri, Stefano (2019)