Browsing by author "Vermeersch, Bjorn"
Now showing items 1-20 of 21
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3 omega correction method for eliminating resistance measurement error due to Joule heating
Guralnik, Benny; Hansen, Ole; Henrichsen, Henrik H.; Beltran-Pitarch, Braulio; osterberg, Frederik W.; Shiv, Lior; Marangoni, Thomas A.; Stilling-Andersen, Andreas R.; Cagliani, Alberto; Hansen, Mikkel F.; Nielsen, Peter F.; Oprins, Herman; Vermeersch, Bjorn; Adelmann, Christoph; Dutta, Shibesh; Borup, Kasper A.; Mihiretie, Besira M.; Petersen, Dirch H. (2021) -
Calibrated fast thermal calculation and experimental characterization of advanced BEOL stacks
Chang, Xinyue; Oprins, Herman; Lofrano, Melina; Cherman, Vladimir; Vermeersch, Bjorn; Diaz Fortuny, Javier; Park, Seongho; Tokei, Zsolt; De Wolf, Ingrid (2023) -
First-principles 3D thermal simulation of microscale devices
Vermeersch, Bjorn; Mingo, Natalio; Bury, Erik; Pourtois, Geoffrey; Oprins, Herman; Nejim, Ahmed (2017) -
III-V HBTs on 300 mm Si substrates using merged nano-ridges and its application in the study of impact of defects on DC and RF performance
Vais, Abhitosh; Yadav, Sachin; Mols, Yves; Vermeersch, Bjorn; Vondkar Kodandarama, Komal; Baryshnikova, Marina; Mannaert, Geert; Alcotte, Reynald; Boccardi, Guillaume; Wambacq, Piet; Parvais, Bertrand; Langer, Robert; Kunert, Bernardette; Collaert, Nadine (2022) -
III-V on a Si platform for the next generations of communication systems
Parvais, Bertrand; Vais, Abhitosh; Yadav, Sachin; Mols, Yves; Vermeersch, Bjorn; Vondkar Kodandarama, Komal; Boccardi, Guillaume; Kunert, Bernardette; Collaert, Nadine (2022) -
III-V/III-N technologies for next generation high-capacity wireless communication
Collaert, Nadine; Alian, AliReza; Banerjee, Aritra; Boccardi, Guillaume; Cardinael, Pieter; Chauhan, Vikas; Desset, Claude; ElKashlan, Rana Y.; Khaled, Ahmad; Ingels, Mark; Kunert, Bernardette; Mols, Yves; O'Sullivan, Barry; Peralagu, Uthayasankaran; Pinho, Nelson; Rodriguez, Raul; Sibaja-Hernandez, Arturo; Sinha, Siddhartha; Sun, Xiao; Vais, Abhitosh; Vermeersch, Bjorn; Yadav, Sachin; Yan, Dongyang; Yu, Hao; Zhang, Yang; Zhao, Ming; Van Driessche, Veerle; Gramegna, Giuseppe; Wambacq, Piet; Parvais, Bertrand; Peeters, Michael (2022) -
Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC
Sankatali, Venkateswarlu; Mishra, Subrat; Oprins, Herman; Vermeersch, Bjorn; Brunion, Moritz; Han, Jun-Han; Stan, Mircea R.; Biswas, Dwaipayan; Weckx, Pieter; Catthoor, Francky (2023) -
Impact of channel thickness scaling on the performance of GaN-on-Si RF HEMTs on highly C-doped GaN buffer
Alian, Alireza; Rodriguez, Raul; Yadav, Sachin; Peralagu, Uthayasankaran; Sibaja-Hernandez, Arturo; Putcha, Vamsi; Zhao, Ming; ElKashlan, Rana Y.; Vermeersch, Bjorn; Yu, Hao; Bury, Erik; Khaled, Ahmad; Collaert, Nadine; Parvais, Bertrand (2022) -
Impact of FEOL cross heating on the thermal performance of advanced BEOL
Lofrano, Melina; Vermeersch, Bjorn; Oprins, Herman; Park, Seongho; Tokei, Zsolt (2022) -
Insights into Scaled Logic Devices Connected from Both Wafer Sides
Veloso, Anabela; Eneman, Geert; Matagne, Philippe; Vermeersch, Bjorn; Jourdain, Anne; Arimura, Hiroaki; O'Sullivan, Barry; Chen, Rongmei; De Keersgieter, An; Simoen, Eddy; Radisic, Dunja; Oniki, Yusuke; Lafitte, A.; Brus, Stephan; Beyne, Eric; Dentoni Litta, Eugenio; Horiguchi, Naoto (2022) -
Nanoscale simulation of self heating and thermal crosstalk in 3D finFET architectures
Vermeersch, Bjorn; Bury, Erik; Croes, Kristof; Oprins, Herman; Kamrani, Hamed; Pourtois, Geoffrey (2019) -
Performance Trade-Off Scenarios for GAA Nanosheet FETs Considering Inner- spacers and Epi-induced Stress: Understanding & Mitigating Process Risks
Rawat, Amita; Bhuwalka, Krishna; Matagne, Philippe; Vermeersch, Bjorn; Wu, Hao; Hellings, Geert; Ryckaert, Julien; Liu, Changze (2021) -
Performance Trade-Off Scenarios for GAA Nanosheet FETs Considering Inner-spacers and Epi-induced Stress: Understanding & Mitigating Process Risks
Rawat, Amita; Bhuwalka, Krishna K.; Matagne, Philippe; Vermeersch, Bjorn; Wu, Hao; Hellings, Geert; Ryckaert, Julien; Liu, Changze (2021) -
Substrate RF Losses and Non-linearities in GaN-on-Si HEMT Technology
Yadav, Sachin; Cardinael, Pieter; Zhao, Ming; Vondkar Kodandarama, Komal; Khaled, Ahmad; Rodriguez, Raul; Vermeersch, Bjorn; Makovejev, S.; Ekoga, E.; Pottrain, A.; Waldron, Niamh; Raskin, J.-P.; Parvais, Bertrand; Collaert, Nadine (2020) -
Thermal analysis of advanced back-end-of-line structures and the impact of design parameters
Chang, Xinyue; Oprins, Herman; Lofrano, Melina; Vermeersch, Bjorn; Ciofi, Ivan; Varela Pedreira, Olalla; Tokei, Zsolt; De Wolf, Ingrid (2022-09-30) -
Thermal Modelling of GaN & InP RF Devices with Intrinsic Account for Nanoscale Transport Effects
Vermeersch, Bjorn; Rodriguez, Raul; Sibaja-Hernandez, Arturo; Vais, Abhitosh; Yadav, Sachin; Parvais, Bertrand; Collaert, Nadine (2022) -
Thermal Performance Analysis of Mempool RISC-V Multicore SoC
Sankatali, Venkateswarlu; Mishra, Subrat; Oprins, Herman; Vermeersch, Bjorn; Brunion, Moritz; Han, Jun-Han; Stan, Mircea R.; Weckx, Pieter; Catthoor, Francky (2022) -
Towards accurate temperature prediction in BEOL for reliability assessment (Invited)
Lofrano, Melina; Oprins, Herman; Chang, Xinyue; Vermeersch, Bjorn; Lesniewska, Alicja; Cherman, Vladimir; Ciofi, Ivan; Croes, Kristof; Park, Seongho; Tokei, Zsolt; Varela Pedreira, Olalla (2023) -
Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs)
Mishra, Subrat; Sankatali, Venkateswarlu; Vermeersch, Bjorn; Brunion, Moritz; Lofrano, Melina; Abdi, Dawit; Oprins, Herman; Biswas, Dwaipayan; Zografos, Odysseas; Hiblot, Gaspard; Van der Plas, Geert; Weckx, Pieter; Hellings, Geert; Myers, James; Catthoor, Francky; Ryckaert, Julien (2023)