Browsing by author "Kirimura, Tomoyuki"
Now showing items 1-6 of 6
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Copper electromigration failure times evaluated over a wide range of voiding phases
Li, Yunlong; Croes, Kristof; Kirimura, Tomoyuki; Siew, Yong Kong; Tokei, Zsolt (2012) -
Electromigration-driven void nucleation and growth in 30nm wide Cu line: Metal cap impact on interfacial Cu diffusion
Kirimura, Tomoyuki; Croes, Kristof; Siew, Yong Kong; Vanstreels, Kris; Czarnecki, Piotr; El-Mekki, Zaid; van der Veen, Marleen; Dictus, Dries; Yoon, A.; Kolics, A.; Boemmels, Juergen; Tokei, Zsolt (2013) -
In-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structures
Vanstreels, Kris; Czarnecki, Piotr; Kirimura, Tomoyuki; Siew, Yong Kong; De Wolf, Ingrid; Boemmels, Juergen; Tokei, Zsolt; Croes, Kristof (2014) -
In-situ SEM observation of electromigration-induced void growth in 30nm ½ pitch Cu interconnect structures
Vanstreels, Kris; Czarnecki, Piotr; Kirimura, Tomoyuki; Siew, Yong Kong; Tokei, Zsolt; Boemmels, Juergen; Croes, Kristof (2013) -
Initial void characterization in 30nm wide polycrystalline Cu line using a local sense EM test structure
Kirimura, Tomoyuki; Croes, Kristof; Li, Yunlong; Demuynck, Steven; Wilson, Chris; Lofrano, Melina; Tokei, Zsolt (2012-04) -
Integration of a k=2.3 spin-on polymer for the sub-28nm technology node
Wilson, Chris; Lazzarino, Frederic; Truffert, Vincent; Kirimura, Tomoyuki; de Marneffe, Jean-Francois; Verdonck, Patrick; Hirai, M.; Nakatani, K.; Tada, M.; Heylen, Nancy; El-Mekki, Zaid; Vanstreels, Kris; Van Besien, Els; Ciofi, Ivan; Stucchi, Michele; Croes, Kristof; Zhang, Liping; Demuynck, Steven; Ercken, Monique; Xu, Kaidong; Baklanov, Mikhaïl; Tokei, Zsolt (2012)