Browsing by author "Cui, Hushan"
Now showing items 1-4 of 4
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Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: application to accelerometers
Guo, Bin; Wen, Lianggong; Helin, Philippe; Claes, Gert; Verbist, Agnes; Van Hoof, Rita; Du Bois, Bert; De Coster, Jeroen; De Wolf, Ingrid; Shahar, Abdul Hadi; Li, Yunlong; Cui, Hushan; Lux, Marcel; Vereecke, Guy; Tilmans, Harrie; Haspeslagh, Luc; Decoutere, Stefaan; Osman, Haris; Puers, Bob; Severi, Simone; Witvrouw, Ann (2011) -
Cleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC) integration
Wostyn, Kurt; Zhao, Ming; Cui, Hushan; Laermans, Patrick; Jourdain, Anne; Verbinnen, Greet; Struyf, Herbert; De Strycker, Steven; Claes, Martine; Travaly, Youssef; Leunissen, Peter (2010) -
Wafer level characterization of the sacrificial HDP oxide lateral etching by anhydrous vapor HF with ethanol vapor for SiGe MEMS structures
Cui, Hushan; Van Hoof, Rita; Severi, Simone; Witvrouw, Ann; Knoops, An; Delande, Tinne; Pancken, Joris; Claes, Martine (2010) -
Wafer level characterization of the sacrificial HDP oxide lateral etching by anhydrous vapor HF with ethanol vapor for SiGe MEMS structures
Cui, Hushan; Van Hoof, Rita; Severi, Simone; Witvrouw, Ann; Knoops, An; Delande, Tinne; Pancken, Joris; Claes, Martine (2010)