Browsing by author "Stiers, Karen"
Now showing items 1-5 of 5
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Development of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoring
Suhard, Samuel; Iwasaki, Akihisa; Liebens, Maarten; Stiers, Karen; Slabbekoorn, John; Holsteyns, Frank (2016) -
GaN-on-Si process defect detection and analysis for HB-LEDs and power devices
Halder, Sandip; Stiers, Karen; Kandaswamy, Prem Kumar; Rosmeulen, Maarten; Carbonell, Laure; Saripalli, Yoga; Osman, Haris; Rosseel, Erik; Mani, Antonio; Hu, Qiona; Vedula, Srinivas; Polli, Marco (2013) -
Height uniformity of micro-bumps electroplated on thin Cu seed layers
Yang, Liu; Slabbekoorn, John; Honore, Mia; Stiers, Karen; Struyf, Herbert; Vereecken, Philippe; Radisic, Alex (2016) -
Height uniformity of micro-bumps electroplated on thin Cu seed layers
Yang, Liu; Slabbekoorn, John; Honore, Mia; Stiers, Karen; Struyf, Herbert; Vereecken, Philippe; Radisic, Alex (2016) -
Metrology and inspection challenges for manufacturing 3D stacked IC's
Halder, Sandip; Stiers, Karen; Miller, Andy; De Wolf, Ingrid; Phommahaxay, Alain; Maenhoudt, Mireille; Beyne, Eric; Guerrieri, Stefano (2013)