Browsing by author "Maekawa, K."
Now showing items 1-6 of 6
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A novel low temperature etch approach to reduce ULK plasma damage
Zhang, Liping; de Marneffe, Jean-Francois; Leroy, F.; Ljazouli, R.; Lefaucheux, P.; Tillocher, T; Dussart, R.; Maekawa, K.; Yatsuda, K.; Dussarrat, C.; De Gendt, Stefan; Baklanov, Mikhaïl (2015) -
A Novel Volatile Film for Dielectric Plasma Damage Protection
de Marneffe, Jean-Francois; Rezvanov, Askar; Chanson, Romain; Babaei Gavan, Khashayar; Fujikawa, M.; Yamaguchi, T.; Nozawa, S.; Kikuchi, Y.; Maekawa, K. (2019) -
Cryogenic etching of porous organosilicate low-k materials: reduction of plasma induced damage
Leroy, F.; Tillocher, T.; Zhang, Liping; Lefaucheux, P.; Yatsuda, K.; Maekawa, K.; de Marneffe, Jean-Francois; Baklanov, Mikhaïl; Dussart, R (2015) -
Low-k cryo-etching : comparison of four different High Boiling Point Organic (HBPO)
Chanson, Romain; Lefaucheux, P.L.; Dussart, R.; Tillocher, T.; Shen, P.; Urabe, K.; Dussarat, C.; Maekawa, K.; Yatsuda, K.; Tahara, S.; de Marneffe, Jean-Francois (2017) -
Plasma cryoetching processes for silicon and advanced materials
Dussart, R.; Tillocher, T.; Gosset, N.; Vital, A; Lefaucheux, P.; L'jazouli, R; Boufnichel, M.; Vayer, M.; Sinturel, C.; Zhang, Liping; de Marneffe, Jean-Francois; Baklanov, Mikhaïl; Nishimura, E.; Yatsuda, K.; Maekawa, K. (2014) -
Reduction of plasma induced damage of porous low-k materials using a cryogenic etching process
Tillocher, T.; Leroy, F.; Zhang, Liping; Lefaucheux, P.; Yatsuda, K.; Maekawa, K.; de Marneffe, Jean-Francois; Baklanov, Mikhaïl; Dussart, R. (2015)