Browsing by imec author "31bc2924ec63747723dfcf06d7b182d39bc7949e"
Now showing items 1-20 of 79
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18% efficiency IBC cell with rear-surface processed on quartz
Dross, Frederic; O'Sullivan, Barry; Debucquoy, Maarten; Bearda, Twan; Govaerts, Jonathan; Labie, Riet; Loozen, Xavier; Granata, Stefano; El Daif, Ounsi; Trompoukis, Christos; Van Nieuwenhuysen, Kris; Meuris, Marc; Gordon, Ivan; Posthuma, Niels; Baert, Kris; Poortmans, Jef; Boulord, Caroline; Beaucarne, Guy (2013) -
A PoF based methodology to assess the reliability of a sensor module operating in harsh industrial environments
Nawghane, Chinmay; Vandevelde, Bart; Labie, Riet; Michiels, Sam; Hughes, Danny; Liu, Mengyao (2022-04-20) -
A simple copper metallisation process for high cell efficiencies and reliable modules
Russell, Richard; Tous, Loic; Philipsen, Harold; Horzel, Jörg; Cornagliotti, Emanuele; Ngamo Toko, Michel; Choulat, Patrick; Labie, Riet; Beckers, Johan; Bertens, Jurgen; Fuji, Masaki; John, Joachim; Poortmans, Jef; Mertens, Robert (2012) -
Bleifrei in die Gehäusezukunft
Parton, Els; Gonzalez, Mario; Labie, Riet; Vandevelde, Bart; Vanfleteren, Jan; Ratchev, Petar (2004) -
Bleifrei in die Gehäusezukunft
Parton, Els; Gonzalez, Mario; Labie, Riet; Vandevelde, Bart; Vanfleteren, Jan; Ratchev, Petar (2003-12) -
Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration
Labie, Riet; Duflos, Frederic; Vandevelde, Bart; Allaert, Bart; Lauwaert, Ralph; Willems, Geert (2018) -
Bond pad pitch reduction down to 40 μm: influence on solder joint fatigue for flip chip structures
Degryse, Dominiek; Labie, Riet; Vandevelde, Bart; Gonzalez, M.; Beyne, Eric (2002) -
Cell-module integration concept compatible with c-Si epitaxial thin foils and with efficiencies over 18%
Dross, Frederic; Van Nieuwenhuysen, Kris; Bearda, Twan; Debucquoy, Maarten; Depauw, Valerie; Govaerts, Jonathan; Boulord, Caroline; Granata, Stefano; Labie, Riet; Loozen, Xavier; Martini, Roberto; O'Sullivan, Barry; Radhakrishnan, S.; Baert, Kris; Gordon, Ivan; Poortmans, Jef (2012) -
Comparison of a Cu UBM versus a Co UBM for Sn flip chip bumps
Labie, Riet; Ratchev, Petar; Beyne, Eric (2005-06) -
Cost-effective and reliable Ni/Cu plating for p- and n-type PERx silicon solar cells
Russell, Richard; Tous, Loic; Labie, Riet; Aleman, Monica; Duerinckx, Filip; Bertens, Jurgen; Horiuchi, Takeshi; Szlufcik, Jozef (2013) -
Creep behavior of mixed SAC 405/ SnPb soldered assemblies in shear loading
Limaye, Paresh; Labie, Riet; Vandevelde, Bart; Vandepitte, Dirk; Verlinden, Bert (2007) -
Crystalline thin-foil silicon solar cells: where crystalline quality meets thin-film processing
Dross, Frederic; Baert, Kris; Bearda, Twan; Deckers, Jan; Depauw, Valerie; El Daif, Ounsi; Gordon, Ivan; Gougam, Adel; Govaerts, Jonathan; Granata, Stefano; Labie, Riet; Loozen, Xavier; Martini, Roberto; Masolin, Alex; O'Sullivan, Barry; Qiu, Yu; Vaes, Jan; Van Gestel, Dries; Van Hoeymissen, Jan; Vanleenhove, Anja; Van Nieuwenhuysen, Kris; Venkatachalam, Srisaran; Meuris, Marc; Poortmans, Jef (2012) -
Cu plated I-perl cells: ageing and humidity reliability tests
Labie, Riet; Hernandez, Jose Luis; Govaerts, Jonathan; Allebe, Christophe; Tous, Loic; Uruena De Castro, Angel; Russell, Richard; Gordon, Ivan; Baert, Kris (2011) -
Cu pumping in TSVs: Effect of pre-CMP thermal budget
De Wolf, Ingrid; Croes, Kristof; Varela Pedreira, Olalla; Labie, Riet; Redolfi, Augusto; Van De Peer, Myriam; Vanstreels, Kris; Okoro, Chukwudi; Vandevelde, Bart; Beyne, Eric (2011) -
Cu-Cu bonding alternative to solder based micro-bumping
Ruythooren, Wouter; Beltran Amenabar, Amaia; Labie, Riet (2007) -
Cu/Sn microbumps interconnect for 3D TSV chip stacking
Agarwal, Rahul; Zhang, Wenqi; Limaye, Paresh; Labie, Riet; Dimcic, Biljana; Phommahaxay, Alain; Soussan, Philippe (2010) -
Design issues and cosiderations for low-cost 3D TSV IC technology
Van der Plas, Geert; Limaye, Paresh; Mercha, Abdelkarim; Oprins, Herman; Torregiani, Cristina; Thijs, Steven; Linten, Dimitri; Stucchi, Michele; Guruprasad, Katti; Velenis, Dimitrios; Shinichi, Domae; Cherman, Vladimir; Vandevelde, Bart; Simons, Veerle; De Wolf, Ingrid; Labie, Riet; Perry, Dan; Bronckers, Stephane; Minas, Nikolaos; Cupak, Miroslav; Ruythooren, Wouter; Van Olmen, Jan; Phommahaxay, Alain; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Rakowski, Michal; De Wachter, Bart; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Marchal, Pol; Beyne, Eric (2010) -
Detailed structural and electrical characterization of plated crystalline silicon solar cells
Dang Thi Thuy, Chi; Labie, Riet; Simoen, Eddy; Poortmans, Jef (2018-05) -
Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures
Dimcic, Biljana; Labie, Riet; De Messemaeker, Joke; Vanstreels, Kris; Croes, Kristof; Verlinden, Bert; De Wolf, Ingrid (2012) -
Electrically active defects in plated crystalline silicon n+p solar cells: a DLTS perspective
Simoen, Eddy; Dang Thi Thuy, Chi; Labie, Riet; Poortmans, Jef (2018)