Browsing by imec author "31bc2924ec63747723dfcf06d7b182d39bc7949e"
Now showing items 21-40 of 78
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Electro-migration behavior of Pb-free flip chip bumps
Labie, Riet; Webers, Tomas; Swinnen, Bart; Beyne, Eric (2005) -
Electromigration failure mechanisms for different flip chip configurations
Labie, Riet; Webers, Tomas; Winters, Christophe; Cherman, Vladimir; Croes, Kristof; Vandevelde, Bart; Dosseul, Franck (2011) -
Electromigration in solder interconnects
Labie, Riet (2011) -
Electromigration, fuse and thermo-mechanical performance of solder bump versus Cu pillar flip chip assemblies
Vandevelde, Bart; Labie, Riet; Cherman, Vladimir; Webers, Tomas; Winters, Christophe; Beyne, Eric; Dosseul, Franck (2011) -
Elimination of the axial deformation problem of Cu-TSV in 3D integration
Okoro, Chukwudi; Huyghebaert, Cedric; Van Olmen, Jan; Labie, Riet; Vandevelde, Bart; Beyne, Eric; Vandepitte, Dirk (2010) -
Encapsulant-integrated interconnection of bifacial solar cells for BIPV applications: Latest results in the TWILL-BIPV project
Govaerts, Jonathan; Borgers, Tom; Van Dyck, Rik; Andries, Nick; Meyers, Pieter; van der Heide, Arvid; Vastmans, Luc; Moors, Reinoud; Doumen, Geert; Nivelle, Philippe; Daenen, Michaël; Voroshazi, Eszter; Arnett, Chad; Labie, Riet; Van den Storme, Manuel; Van den Storme, Guy; Dekens, Marc; Vandebroek, Steven; Schroyen, Peter; Smeers, Kris; Vavilkin, Tatjana; Dewallef, Stefan; Abgrall, Florent; Jousset, Dominique; Poortmans, Jef (2020-10) -
ENHANCED PROCESSABILITY AND THERMAL FATIGUE RELIABILITY WITH LOW MELTING POINT SNBI SOLDER ALLOY LMPA-Q
Vandevelde, Bart; Nawghane, Chinmay; Labie, Riet; Lauwaert, Ralph; Werkhoven, Daniel (2021) -
Fine pitch Cu/Sn solid state diffusion bonding for making high yield bump interconnections and its application in 3D integration
Zhang, Wenqi; Limaye, Paresh; Civale, Yann; Labie, Riet; Soussan, Philippe (2010) -
Finite element analysis of ultra thin BGA package: first and second level reliability
Limaye, Paresh; Vandevelde, Bart; de Vries, Hans; Degryse, Dominiek; Slob, Kees; van Veen, Co; Labie, Riet (2004-05) -
Finite element modeling of shear test on bumped Cu-low K wafers
Degryse, Dominiek; Labie, Riet; Vandevelde, Bart; Beyne, Eric (2003) -
Flip-Chip Montage statt Draht-Bonden
Labie, Riet; Beyne, Eric; Van Hoof, Rita; Honoré, Mia; Beerten, Steven (2000) -
Flip-chip redistribution using Ti/Cu thin film and electroless Ni/Au tracks
Beerten, Steven; Labie, Riet; Beyne, Eric; Van Hoof, Rita; Honoré, Mia (2000) -
Four-point bending cycling as alternative for thermal cycling solder fatigue testing
Vandevelde, Bart; Vanhee, Filip; Pissoort, Davy; Degrendele, Lieven; De Baets, Johan; Allaert, Bart; Lauwaert, Ralph; Labie, Riet; Willems, Geert (2016-04) -
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
Vandevelde, Bart; Vanhee, Filip; Pissoort, Davy; Degrendele, Lieven; De Baets, Johan; Allaert, Bart; Lauwaert, Ralph; Zanon, Franco; Labie, Riet; Willems, Geert (2017) -
Hermetically sealed on-chip packaging of MEMS devices
De Moor, Piet; Tilmans, Harrie; Van De Peer, Myriam; Labie, Riet; Beerten, Steven; Beyne, Eric; Van Hoof, Chris (2000) -
High-quality epitaxial foils, obtained by a layer transfer process, for integration in back-contacted solar cells processed on glass
Van Nieuwenhuysen, Kris; Gordon, Ivan; Bearda, Twan; Boulord, Caroline; Debucquoy, Maarten; Depauw, Valerie; Dross, Frederic; Govaerts, Jonathan; Granata, Stefano; Labie, Riet; Loozen, Xavier; Martini, Roberto; O'Sullivan, Barry; Sivaramakrishnan Radhakrishnan, Hariharsudan; Baert, Kris; Poortmans, Jef (2012) -
Impact of intermetallic formation and electro-migration on the integrity of bumped Cu/low-k Die
Labie, Riet; Beyne, Eric; Degryse, Dominiek (2003) -
Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu
Okoro, Chukwudi; Labie, Riet; Vanstreels, Kris; Franquet, Alexis; Gonzalez, Mario; Vandevelde, Bart; Beyne, Eric; Vandepitte, Dirk; Verlinden, Bert (2011) -
Impact of thinning and through silicon via proximity on high-k / metal gate first CMOS performance
Mercha, Abdelkarim; Redolfi, Augusto; Stucchi, Michele; Minas, Nikolaos; Van Olmen, Jan; Thangaraju, Sarasvathi; Velenis, Dimitrios; Domae, Shinichi; Yang, Yu; Katti, Guruprasad; Labie, Riet; Okoro, Chukwudi; Zhao, Ming; Asimakopoulos, Panagiotis; De Wolf, Ingrid; Chiarella, Thomas; Schram, Tom; Rohr, Erika; Van Ammel, Annemie; Jourdain, Anne; Ruythooren, Wouter; Armini, Silvia; Radisic, Alex; Philipsen, Harold; Heylen, Nancy; Kostermans, Maarten; Jaenen, Patrick; Sleeckx, Erik; Sabuncuoglu Tezcan, Deniz; Debusschere, Ingrid; Soussan, Philippe; Perry, Dan; Van der Plas, Geert; Cho, Jong Hoon; Marchal, Pol; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2010) -
Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q
Vandevelde, Bart; Labie, Riet; Lauwaert, Ralph; Werkhoven, Daniel; Vanderstraeten, Daniel; Blansaer, Eddy; Lannoo, Jonas; Pissoort, Davy (2019)