Browsing by author "Christiaens, Wim"
Now showing items 1-20 of 27
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3D integrated ultra-thin functional microcontroller device for wireless, flexible ECG systems
Christiaens, Wim; Torfs, Tom; Huwel, W.; Van Hoof, Chris; Vanfleteren, Jan (2009) -
3D integration of ultra-thin functional devices inside standard multilayer flex laminates
Christiaens, Wim; Torfs, Tom; Huwel, W.; Van Hoof, Chris; Vanfleteren, Jan (2009) -
3D-stacking of UTCPs as a module miniaturisation
Priyabadini, Swarnakamal; Gielen, An; Dhaenens, Kristof; Christiaens, Wim; Van Put, Steven; Kunkel, G.; Petersen, A.E.; Vanfleteren, Jan (2011) -
A reliable and comfortable package for wearable medical devices
Sterken, Tom; Vanfleteren, Jan; Bossuyt, Frederick; Brebels, Steven; Christiaens, Wim; Vervust, Thomas; Jablonski, Michal; Dunphy, Sheila; Vermeiren, Filip; Hsu, Y.-Y.; Torfs, Tom; Op de Beeck, Maaike (2011) -
Active and passive component integration in polyimide interconnection substrates
Christiaens, Wim (2009-01) -
Active optical links embedded in flexible substrates
Bosman, Erwin; Van Steenberge, Geert; Christiaens, Wim; Hendrickx, Nina; Vanfleteren, Jan; Van Daele, Peter (2008-05) -
Design and implementation of flexible and stretchable systems
Gonzalez, Mario; Vandevelde, Bart; Christiaens, Wim; Hsu, Yung-Yu; Iker, Francois; Bossuyt, Frederick; van der Sluis, Olaf; Timmermans, P.H.M. (2011) -
Embedded chips redefine miniaturization: inexpensive, high-performance packages can be fabricated by laminating thin, flexible, mechanical devices into conventional multiilayer circuit boards
Parton, Els; Christiaens, Wim; Vanfleteren, Jan (2009-07) -
Embedding and assembly of ultrathin chips in multilayer flex boards
Christiaens, Wim; Loeher, T.; Pahl, B.; Feil, M.; Vandevelde, Bart; Vanfleteren, Jan (2008) -
Embedding of active components in multilayer flex boards
Christiaens, Wim; Loeher, T.; Feil, M.; Vandevelde, Bart; Vanfleteren, Jan (2007-03) -
Embedding of optical interconnections in flexible electronics
Bosman, Erwin; Van Steenberge, Geert; Geerinck, Peter; Christiaens, Wim; Vanfleteren, Jan; Van Daele, Peter (2007-05) -
Embedding thinned dies in flexible PCBs
Sterken, Tom; Vermeiren, Filip; Tremlett, P.; Christiaens, Wim; Vanfleteren, Jan (2012) -
Fabrication processes for embedding thin chips in flat flexible substrates
Govaerts, Jonathan; Christiaens, Wim; Bosman, Erwin; Vanfleteren, Jan (2009) -
Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology
Govaerts, Jonathan; Bosman, Erwin; Christiaens, Wim; Vanfleteren, Jan (2010) -
Flexible embedded active optical link
Bosman, Erwin; Van Steenberge, Geert; Hendrickx, Nina; Christiaens, Wim; Vanfleteren, Jan; Van Daele, Peter (2008-04) -
Flexible wireless biopotential system with embedded ultra-thin chip
Torfs, Tom; Christiaens, Wim; Vanfleteren, Jan; Huwel, Wim; Perdu, Wim; Yazicioglu, Refet Firat; Brebels, Steven; Van Hoof, Chris (2009-03) -
Functionality and reliability testing of bendable ultrathin chip packages (UTCP's)
Christiaens, Wim; Torfs, Tom; Huwel, W.; Vanfleteren, Jan (2008-09) -
High density 3D die stacking without through-Si-vias: ultra thin chip embedding as enabling technology
Beyne, Eric; Iker, Francois; Soussan, Philippe; Funaya, Takuo; Vanfleteren, Jan; Cotrin Teixeira, Ricardo; Torfs, Tom; Christiaens, Wim (2008) -
Improved passive-matrix multiplexability with a modular display and UTCP technology
Bauwens, Pieter; Monte, Ann; Christiaens, Wim; Doutreloigne, Jan; Vanfleteren, Jan (2009) -
Integration of thin flexible RF structures into flexible PCB
Christiaens, Wim; Burkard, H.; Link, J.; Vanfleteren, Jan (2007-06)