Browsing by author "Deconinck, Johan"
Now showing items 1-9 of 9
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Bottom-up filling of through-silicon vias due to suppressor desorption
Yang, Liu; Radisic, Alex; Deconinck, Johan; Vereecken, Philippe (2013) -
Copper plating uniformity on resistive substrate with segmented anode
Yang, Liu; Radisic, Alex; Deconinck, Johan; Vereecken, Philippe (2013) -
Modeling the bottom-up filling of through-silicon vias through suppressor adsorption/desorption mechanism
Yang, Liu; Radisic, Alex; Deconinck, Johan; Vereecken, Philippe (2013) -
Multi-scale modeling of direct copper plating on resistive non-copper substrates
Yang, Liu; Radisic, Alex; Nagar, Magi; Deconinck, Johan; Leunissen, Peter; Vereecken, Philippe; West, Alan (2012-10) -
Multi-scale modeling of direct copper plating on resistive non-copper substrates
Yang, Liu; Radisic, Alex; Nagar, Magi; Deconinck, Johan; Vereecken, Philippe; West, Alan (2012) -
Role of oxygen and cuprous ions in copper electroplating
Yang, Liu; Marchal, Wouter; Radisic, Alex; Deconinck, Johan; Vereecken, Philippe (2013-03) -
Stochastic modeling of polyethylene glycol as a suppressor in copper electroplating
Yang, Liu; Radisic, Alex; Deconinck, Johan; Vereecken, Philippe (2014) -
The limitation and optimization of bottom-up growth mode in through silicon via electroplating
Yang, Liu; Radisic, Alex; Deconinck, Johan; Vereecken, Philippe (2015) -
Wafer-scale Cu plating uniformity on thin Cu seed layers
Yang, Liu; Atanasova, Tanya; Radisic, Alex; Deconinck, Johan; West, Alan; Vereecken, Philippe (2013)