Browsing by author "Chandrasekhar, Arun"
Now showing items 1-20 of 25
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Accurate Extraction of Time Domain Performance through Windowless Transforms
Balachandran, Jayaprakash; Chandrasekhar, Arun; Beyne, Eric; De Raedt, Walter; Nauwelaers, Bart (2003) -
Accurate RF electrical characterisation of CSPs using MCM-D thin film technology
Chandrasekhar, Arun; Beyne, Eric; De Raedt, Walter; Nauwelaers, Bart (2002) -
Accurate RF electrical characterisation of CSPs using MCM-D thin film technology
Chandrasekhar, Arun; Beyne, Eric; De Raedt, Walter; Nauwelaers, Bart (2004) -
Analysis, modelling and design of chip scale packages (CSPs) for RF and high-speed digital interconnections
Chandrasekhar, Arun (2004-10) -
Characterisation of the Polymer Stud Grid Array (PSGA), a lead-free CSP for high performance and high reliable packaging
Vandevelde, Bart; Driessens, Evelien; Chandrasekhar, Arun; Beyne, Eric; Van Puymbroeck, Jan; Heerman, M. (2001) -
Characterisation of IC packages for RF applications
Chandrasekhar, Arun; Beyne, Eric; De Raedt, Walter; Nauwelaers, Bart (2001) -
Characterisation, modelling and design of bond-wire interconnects for chip-package co-design
Chandrasekhar, Arun; Stoukatch, Serguei; Brebels, Steven; Balachandran, Jayaprakash; Beyne, Eric; De Raedt, Walter; Nauwelaers, Bart; Podddar, Anindya (2003) -
Comparison of the RF electrical performance of the PSGA and the BGA package
Chandrasekhar, Arun; Beyne, Eric; De Raedt, Walter; Nauwelaers, Bart (2001) -
Distributed circuit models for near-CSP interconnects
Chandrasekhar, Arun; Beyne, Eric; De Raedt, Walter; Nauwelaers, Bart (2002) -
Electrical characterisation of the BGA package for RF applications
Chandrasekhar, Arun; Beyne, Eric; De Raedt, Walter; Nauwelaers, Bart; Van Bever, T. (2002) -
Electrical characterisation of the BGA package for RF applications
Chandrasekhar, Arun; Beyne, Eric; De Raedt, Walter; Nauwelaers, Bart; Van Bever, T. (2002) -
Factors involved in performance optimisation of GHz chip-package co-design
Chandrasekhar, Arun; Brebels, Steven; Rottenberg, Xavier; Vandevelde, Bart; Driessens, Evelien; Balachandran, Jayaprakash; Beyne, Eric; De Raedt, Walter; Nauwelaers, Bart; Mertens, Robert (2004-11) -
Foundations for successful RF chip-package co-design: a packaging perspective
Chandrasekhar, Arun; Beyne, Eric; De Raedt, Walter; Nauwelaers, Bart (2002) -
Modeling and characterization of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification
Chandrasekhar, Arun; Vandevelde, Bart; Driessens, Evelien; Beyne, Eric; De Raedt, Walter; Pieters, Philip; Nauwelaers, Bart; Van Puymbroeck, Jef (2003) -
Modelling and characterisation of the polymer stud grid array (PSGA) package: electrical, thermal and thermo-mechanical qualification
Chandrasekhar, Arun; Vandevelde, Bart; Driessens, Evelien; Pieters, Philip; Beyne, Eric; De Raedt, Walter; Nauwelaers, Bart; Van Puymbroeck, Jan (2001) -
Polymer Stud Grid Array, a lead-free and economic CSP
Vandevelde, Bart; Driessens, Evelien; Chandrasekhar, Arun; Beyne, Eric; Van Puymbroeck, Jan; Heerman, M. (2001) -
Reliability assessment for the Polymer Stud Grid Array (PSGA) package
Vandevelde, Bart; Driessens, Evelien; Chandrasekhar, Arun; Beyne, Eric; Van Puymbroeck, Jef; Heerman, M. (2000) -
RF evaluation of low-cost leadless packages and devlopment of distributed electrical models
Chandrasekhar, Arun; Brebels, Steven; Beyne, Eric; De Raedt, Walter; Nauwelaers, Bart; Van Bever, T. (2003) -
Statistical analysis and modelling of low-cost leadless packages for wireless applications based on non-destructive measurements
Pfeiffer, Ullrich; Chandrasekhar, Arun (2003) -
The influence of packaging materials on RF performance
Chandrasekhar, Arun; Brebels, Steven; Stoukatch, Serguei; Beyne, Eric; De Raedt, Walter; Nauwelaers, Bart (2002)