Browsing by author "Ho, Meng"
Now showing items 1-13 of 13
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Advanced wire bonding: bonding on copper
Ho, Meng; Lam, Kan Wai; Stoukatch, Serguei; Ratchev, Petar; Vath, C. J.; Beyne, Eric (2002) -
Bonding on Cu: a new stress evaluation approach by Raman spectroscopy
Chen, Jian; Ho, Meng; Lam, Kan Wai; Ratchev, Petar; Stoukatch, Serguei; Beyne, Eric; Vath, C.J.; De Wolf, Ingrid (2002) -
Copper wire bonding to advanced copper back-end integrated circuits
Beyne, Eric; Ho, Meng; Stoukatch, Serguei; Lam, Kan Wai; Ratchev, Petar; Degryse, Dominiek; Vath III, C.J. (2003) -
Corrosion inhibition by self-assembled monolayers for enhanced wire bonding on Cu surfaces
Whelan, Caroline; Kinsella, Michael; Carbonell, Laure; Ho, Meng; Maex, Karen (2003) -
Direct Au and Cu wire bonding on Cu/Low-k BEOL
Banda, Pedro; Ho, Meng; Whelan, Caroline; Lam, Kan Wai; Vath, C.J.; Beyne, Eric (2002) -
Direct gold and copper wires bonding on copper
Ho, Meng; Lam, Wai; Stoukatch, Serguei; Ratchev, Petar; Vath, Charles J.; Beyne, Eric (2003) -
Effect of recrystallization and grain growth on the reliability of Cu-Cu wire bonds
Ratchev, Petar; Van De Peer, Myriam; Ho, Meng; Verlinden, B.; Bender, Hugo; De Wolf, Ingrid (2003) -
Fine pitch copper wire bonding on copper bond pad process optimization
Lam, Kan Wai; Ho, Meng; Stoukatch, Serguei; Ratchev, Petar; Vath, C.J.; Schervan, A.; Beyne, Eric (2002) -
Flip chip assembly using SBB of high frequency GaAs modules
Stoukatch, Serguei; Ho, Meng; Vaesen, Kristof; Brebels, Steven; De Raedt, Walter; Beyne, Eric (2002) -
High density 3-D stack structure for SIP solutions
Stoukatch, Serguei; Ho, Meng; Vaesen, Kristof; Webers, Tomas; Carchon, Geert; De Raedt, Walter; Beyne, Eric; De Baets, Johan; Naem, Abdalla; Poddar, Anindya (2003) -
Miniaturization using 3-D stack structure for SIP applications
Stoukatch, Serguei; Ho, Meng; Vaesen, Kristof; Webers, Tomas; Carchon, Geert; De Raedt, Walter; Beyne, Eric; De Baets, Johan (2003) -
Mixed assembly on PCB of wide variety components (MCM-D, SMDs, bare dies) using wire bonding and SMT
Stoukatch, Serguei; Vaesen, Kristof; Ho, Meng; Beyne, Eric (2002) -
Orientation imaging microscopy applications in Cu-interconnects and Cu-Cu wire bonding
Ratchev, Petar; Carbonell, Laure; Ho, Meng; Bender, Hugo; De Wolf, Ingrid; Verlinden, B. (2002)