Browsing by author "Vertommen, Johan"
Now showing items 1-5 of 5
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Exploring high aspEct ratio 2μm TSV (25:1)
Kostermans, Maarten; Brouri, Mohand; Baier, Ulrich; Vertommen, Johan; Pageau, Arnaud; Boullart, Werner (2011-11) -
Interplay between dry etch and wet clean in patterning La2O3/HfO2-containing high-k/metal gate stacks
Vos, Ingrid; Hellin, David; Vrancken, Christa; Geypen, Jef; Bender, Hugo; Vecchio, Emma; Paraschiv, Vasile; Vertommen, Johan; Boullart, Werner (2009) -
Interplay of plasma etch, strip and wet clean in patterning La2O3/HfO2-containing high-k metal gate stacks
Vos, Ingrid; Hellin, David; Boullart, Werner; Vertommen, Johan (2011) -
Novel patterning shrink technique enabling sub-50nm trench and contact integration
Demuynck, Steven; Tokei, Zsolt; Zhao, Chao; de Marneffe, Jean-Francois; Struyf, Herbert; Boullart, Werner; Op de Beeck, Maaike; Carbonell, Laure; Heylen, Nancy; Vaes, Jan; Beyer, Gerald; Vanhaelemeersch, Serge; Zhu, Helen; Cirigliano, Peter; Kim, J. S.; Vertommen, Johan; Coenegrachts, Bart; Sadjadi, R.; Pavel, E.; Athayde, A. (2007) -
The effect of etch-clean delay time on post-etch residue removal for front-end-of-line applications
Vos, Ingrid; Hellin, David; Vereecke, Guy; Pavel, Elisabeth; Boullart, Werner; Vertommen, Johan (2009)