Browsing by author "Yu, C.H."
Now showing items 1-4 of 4
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3D stacking using Cu-Cu direct bonding for 40μm pitch and beyond
Hu, Yu-Hsiang; Rebibis, Kenneth June; Zhao, Ming; La Manna, Antonio; Beyne, Eric; Liu, C.S.; Lii, M.J.; Yu, C.H. (2012) -
Cu-Cu hybrid bonding as option for 3D IC stacking
Hu, Yu-Hsiang; Lii, M.J.; Rebibis, Kenneth June; Jourdain, Anne; La Manna, Antonio; Beyne, Eric; Yu, C.H. (2012) -
Self aligned CuGeN process for 32/22nm nodes and beyond
Liu, C.S.; Chen, H.C.; Bao, T.I.; Van Olmen, Jan; Croes, Kristof; Van Besien, Els; Pantouvaki, Marianna; Zhao, Chao; Sleeckx, Erik; Beyer, Gerald; Yu, C.H. (2008) -
The role of additives and deposition parameters in Cu plating of high aspect ratio vias
Ko, Ted; Radisic, Alex; Armini, Silvia; Vereecken, Philippe; Drijbooms, Chris; Bender, Hugo; Sun, S.P.; Wann, C.; Yu, C.H.; Leunissen, Peter; Ruythooren, Wouter; Vanhaelemeersch, Serge (2009-10)