Browsing by author "Willems, Geert"
Now showing items 1-20 of 44
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Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
Van Steenberge, Nele; Limaye, Paresh; Willems, Geert; Vandevelde, Bart; Schildermans, Inge (2007) -
Analytical and finite element models of the thermal behaviour for lead-free soldering processes in electronic assembly
Van Steenberge, Nele; Vandevelde, Bart; Schildermans, Inge; Willems, Geert (2005-04) -
Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration
Labie, Riet; Duflos, Frederic; Vandevelde, Bart; Allaert, Bart; Lauwaert, Ralph; Willems, Geert (2018) -
Capacity vs. availability trade-offs in mesh-restorable WDM networks
Willems, Geert; Arijs, Peter; Van Parys, Wim; Demeester, Piet (2001) -
Cost modelling for embedded component technology
De Baets, Johan; Willems, Geert; Ostmann, A.; Kriechbaum, A.; Kostner, H. (2007-06) -
DTCO including Sustainability: Power-Performance-Area-Cost-Environmental score (PPACE) Analysis for Logic Technologies
Garcia Bardon, Marie; Wuytens, Pieter; Ragnarsson, Lars-Ake; Mirabelli, Gioele; Jang, Doyoung; Willems, Geert; Mallik, Arindam; Spessot, Alessio; Ryckaert, Julien; Parvais, Bertrand (2020) -
Early fatigue failures in copper wire bonds inside packages with low CTE green mold compounds
Vandevelde, Bart; Willems, Geert (2012) -
Effects of TOP electrode annealing on the PZT thin films
Lee, Eun Gu; Wouters, Dirk; Willems, Geert; Maes, Herman (1997) -
Electrical conductivity in ferroelectric thin films
Wouters, Dirk; Willems, Geert; Maes, Herman (1995) -
Elements of the leakage current of high-e ferroelectric PZT films
Wouters, Dirk; Willems, Geert; Groeseneken, Guido; Maes, Herman; Brooks, K. (1995) -
Elements of the Leakage Current of High-Epsilon Ferroelectric PZT Films
Wouters, D. J.; Willems, Geert; Groeseneken, Guido; Maes, Herman; Brooks, K. (1994) -
Elucidation of the switching process in tetragonal PZT by hysteresis loop and impedance analysis
Wouters, Dirk; Willems, Geert; Lee, Eun Gu; Maes, Herman (1997) -
Finite element modeling of aolder joint fatigue in four-point bending test
Sabuncuoglu, Baris; Vanhee, Filip; Willems, Geert; Vandevelde, Bart; Vandepitte, Dirk; De Wolf, Ingrid (2012) -
Four-point bending cycling as alternative for thermal cycling solder fatigue testing
Vandevelde, Bart; Vanhee, Filip; Pissoort, Davy; Degrendele, Lieven; De Baets, Johan; Allaert, Bart; Lauwaert, Ralph; Labie, Riet; Willems, Geert (2016-04) -
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
Vandevelde, Bart; Vanhee, Filip; Pissoort, Davy; Degrendele, Lieven; De Baets, Johan; Allaert, Bart; Lauwaert, Ralph; Zanon, Franco; Labie, Riet; Willems, Geert (2017) -
Green mold compounds: impact on second level interconnect reliability
Vandevelde, Bart; Lofrano, Melina; Willems, Geert (2011-12) -
Hidden-head-in-pillow soldering failures
Vandevelde, Bart; Willems, Geert; Allaert, Bart (2014) -
How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance
Vandevelde, Bart; Degrendele, Lieven; Cauwe, Maarten; Allaert, Bart; Lauwaert, Ralph; Willems, Geert (2016-04) -
Impact GMC on first and second level interconnect reliability
Willems, Geert; Vandevelde, Bart (2013) -
Impact GMC on first and second level interconnect reliability
Willems, Geert; Vandevelde, Bart (2013)