Browsing by author "Degryse, Dominiek"

A finite element study of process induced stress in the transistor channel: effects of silicide contact and gate stack

Torregiani, Cristina; Liu, Joy; Vandevelde, Bart; Degryse, Dominiek; Van Dal, Mark; Benedetti, Alessandro; Lauwers, Anne; Maex, Karen (2004)

Bond pad pitch reduction down to 40 μm: influence on solder joint fatigue for flip chip structures

Degryse, Dominiek; Labie, Riet; Vandevelde, Bart; Gonzalez, M.; Beyne, Eric (2002)

Copper wire bonding to advanced copper back-end integrated circuits

Beyne, Eric; Ho, Meng; Stoukatch, Serguei; Lam, Kan Wai; Ratchev, Petar; Degryse, Dominiek; Vath III, C.J. (2003)

Cross-section nano-indentation for rapid adhesion evaluation

Brongersma, Sywert; Degryse, Dominiek; Souiller, Jérôme; Vandevelde, Bart; Maex, Karen (2004)

Cu bonding to Cu low K wafers: a systematic study of the mechanical bonding process

Degryse, Dominiek; Vandevelde, Bart; Beyne, Eric (2005)

FEM study of deformation and stresses in copper wire bonds on Cu lowK structures during processing

Degryse, Dominiek; Vandevelde, Bart; Beyne, Eric (2004)

Finite element analysis of ultra thin BGA package: first and second level reliability

Limaye, Paresh; Vandevelde, Bart; de Vries, Hans; Degryse, Dominiek; Slob, Kees; van Veen, Co; Labie, Riet (2004-05)

Finite element modeling of shear test on bumped Cu-low K wafers

Degryse, Dominiek; Labie, Riet; Vandevelde, Bart; Beyne, Eric (2003)

Impact of intermetallic formation and electro-migration on the integrity of bumped Cu/low-k Die

Labie, Riet; Beyne, Eric; Degryse, Dominiek (2003)

Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode

Vandevelde, Bart; Van Kerckhove, Matthias; Degryse, Dominiek; D'Haese, Wim; Schaubroeck, David; Allaert, Bart; Geerinckx, Eddy; Lauwaert, Ralph; Willems, Geert (2013)

Kupfer-zu-Kupfer Wire-Bonding erfordert eine Anpassung des Bondprozesses - Massnahmen gegen die Oxidationsgefahr

Van Bavel, Mieke; Degryse, Dominiek; Stoukatch, Serguei; Vandevelde, Bart; Beyne, Eric (2004-04)

Mechanical behavior of BEOL structures containing lowK dielectrics during bonding process

Degryse, Dominiek; Stoukatch, Serguei; Vandevelde, Bart; Beyne, Eric (2003)

Mechanical FEM simulation of bonding process on Cu low K wafers

Degryse, Dominiek; Vandevelde, Bart; Beyne, Eric (2003)

Mechanical FEM simulation of bonding process on Cu lowK wafers

Degryse, Dominiek; Vandevelde, Bart; Beyne, Eric (2004)

Mechanical issues of Cu to Cu wire bonding

Chen, Jian; Degryse, Dominiek; Ratchev, Petar; De Wolf, Ingrid (2004-09)

Modified micro-macro thermo-mechanical modelling of ceramic ball grid array packages

Vandevelde, Bart; Degryse, Dominiek; Beyne, Eric; Roose, E.; Corlatan, D.; Swaelen, G.; Willems, G.; Christiaens, F.; Vandepitte, D.; Baelmans, M. (2003)

On the spatial resolution of scanning spreading resistance microscopy: experimental assessment and electro-mechanical modeling

Eyben, Pierre; Degryse, Dominiek; Vandervorst, Wilfried (2005)