Browsing by author "Heerman, M."
Now showing items 1-20 of 22
-
Characterisation of the Polymer Stud Grid Array (PSGA), a lead-free CSP for high performance and high reliable packaging
Vandevelde, Bart; Driessens, Evelien; Chandrasekhar, Arun; Beyne, Eric; Van Puymbroeck, Jan; Heerman, M. (2001) -
Compact transient thermal models for the polymer stud grid array (PSGATM) package
Christiaens, Filip; Beyne, Eric; Vandevelde, Bart; Roggen, Jean; Mertens, Robert; Van Puymbroeck, Jef; Heerman, M.; Berghmans, J. (1997) -
Effect on thermal fatigue reliability of decreasing the pitch of PSGA packages from 0.8 to 0.3 mm
Vandevelde, Bart; Beyne, Eric; Van Puymbroeck, Jan; Heerman, M. (1999) -
Improved solder joint reliability in polymer stud grid array packages by structural design optimisation
Vandevelde, Bart; Christiaens, Filip; Beyne, Eric; Roggen, Jean; Van Puymbroeck, J.; Heerman, M. (1996) -
Local stress analysis on polymer sud grid array (PSGA) packages by raman spectroscopy and FEM simulation
Chen, Jian; Vandevelde, Bart; De Wolf, Ingrid; Van Puymbroeck, Jan; Heerman, M. (2001) -
Optimising the solder joint reliability of polymer stud grid array (PSGATM) packages using thermo-mechanical analysis
Vandevelde, Bart; Christiaens, Filip; Beyne, Eric; Van Puymbroeck, Jan; Heerman, M. (1997) -
Parametric compact models for the 72-pins polymer stud grid array (Tm)
Driessens, Evelien; Van Dooren, Sofie; Vandevelde, Bart; Degryse, Dominiek; Beyne, Eric; Heerman, M.; Van Puymbroeck, Jef (2001) -
Parametric compact models for the 72-pins Polymer Stud Grid ArrayTM
Driessens, Evelien; Van Dooren, Sofie; Vandevelde, Bart; Degryse, Dominiek; Beyne, Eric; Heerman, M.; Van Puymbroeck, Jef (2000) -
Polymer Stud Grid Array, a lead-free and economic CSP
Vandevelde, Bart; Driessens, Evelien; Chandrasekhar, Arun; Beyne, Eric; Van Puymbroeck, Jan; Heerman, M. (2001) -
PSGA - an innovative IC package for single and multichip designs
Beyne, Eric; Heerman, M. (1997) -
Reliability assessment for the Polymer Stud Grid Array (PSGA) package
Vandevelde, Bart; Driessens, Evelien; Chandrasekhar, Arun; Beyne, Eric; Van Puymbroeck, Jef; Heerman, M. (2000) -
The Plastic Stud Grid Array, a low cost solution for packaging and assembling high pin count devices
Beyne, Eric; Christiaens, Filip; Vandevelde, Bart; Roggen, Jean; Van Puymbroeck, Jan; Dumoulin, A.; Boone, L.; Heerman, M. (1995) -
The polymer stud grid array package
Beyne, Eric; Vandevelde, Bart; Christiaens, Filip; Roggen, Jean; Van Puymbroeck, J.; Boone, L.; Heerman, M. (1996) -
The polymer stud grid array package
Beyne, Eric; Christiaens, Filip; Vandevelde, Bart; Roggen, Jean; Van Puymbroeck, J.; Boone, L.; Heerman, M. (1996) -
The PSGA, a lead-free CSP for high performance and high reliable packaging
Vandevelde, Bart; Chandrasekhar, Arun; Driessens, Evelien; Beyne, Eric; Van Puymbroeck, Jef; Heerman, M. (2001) -
The stud grid array, a low cost solution for packaging and assembling high pin count devices
Beyne, Eric; Christiaens, Filip; Roggen, Jean; Van Puymbroeck, Jan; Dumoulin, A.; Boone, L.; Heerman, M. (1995) -
Thermal and thermo-mechanical evaluation of a 'chip in moulded interconnect device'
Christiaens, Filip; Beyne, Eric; Roggen, Jean; Van Puymbroeck, Jan; Heerman, M. (1997) -
Thermal fatigue analysis of the flip chip assembly on the Polymer Stud Grid Array (PSGA(tm)) package
Vandevelde, Bart; Beyne, Eric; Van Puymbroeck, Jan; Heerman, M. (1999) -
Thermal fatigue analysis of the FLIP CHIP assembly on the POLYMER STUD GRID ARRAY (PSGA(tm)) package
Vandevelde, Bart; Beyne, Eric; Van Puymbroeck, Jan; Heerman, M. (1999) -
Thermal modelling of polymer stud grid array (PSGA) package
Christiaens, Filip; Beyne, Eric; Vandevelde, Bart; Roggen, Jean; Mertens, Robert; Van Puymbroeck, Jan; Heerman, M.; Bergmans, J. (1998)